Bump formation and flip chip processes for RF system-on-packages
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jung, B.-Y. | - |
dc.contributor.author | Choi, E.-K. | - |
dc.contributor.author | Jeon, Y.-S. | - |
dc.contributor.author | Lee, K.-Y. | - |
dc.contributor.author | Seo, K.-K. | - |
dc.contributor.author | Oh, T.-S. | - |
dc.date.accessioned | 2022-01-14T09:42:30Z | - |
dc.date.available | 2022-01-14T09:42:30Z | - |
dc.date.created | 2022-01-14 | - |
dc.date.issued | 2007 | - |
dc.identifier.issn | 1012-0394 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/24213 | - |
dc.description.abstract | For flip-chip process of RF system-on-packages(SOP), double bump bonding processes were investigated. Sn-Ag and Sn solder joints were formed by the reflowed double bumping process, and Sn/In/Sn bump joints were fabricated by the non-reflowed double bump bonding process. The height-to-size ratios of 0.78 and 0.65 were obtained for the reflowed double bumping and the non-reflowed bumping, respectively. Average contact resistance of the reflowed Sn-Ag and Sn solder joints was about 13mΩ which was much lower than 24-33mΩ of the non-reflowed Sn/In/Sn bump joints. The reflowed solder double bumping method is more suitable for flip-chip process of RF-SOP than the non-reflowed double bump bonding. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Trans Tech Publications Ltd | - |
dc.title | Bump formation and flip chip processes for RF system-on-packages | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Oh, T.-S. | - |
dc.identifier.doi | 10.4028/3-908451-31-0.25 | - |
dc.identifier.scopusid | 2-s2.0-38549164350 | - |
dc.identifier.bibliographicCitation | Solid State Phenomena, v.124-126, no.PART 1, pp.25 - 28 | - |
dc.relation.isPartOf | Solid State Phenomena | - |
dc.citation.title | Solid State Phenomena | - |
dc.citation.volume | 124-126 | - |
dc.citation.number | PART 1 | - |
dc.citation.startPage | 25 | - |
dc.citation.endPage | 28 | - |
dc.type.rims | ART | - |
dc.type.docType | Conference Paper | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordAuthor | Bump | - |
dc.subject.keywordAuthor | Electronic package | - |
dc.subject.keywordAuthor | Flip chip | - |
dc.subject.keywordAuthor | RF package | - |
dc.subject.keywordAuthor | SOP | - |
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