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Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMS
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, KD | - |
| dc.contributor.author | Park, J | - |
| dc.contributor.author | Lee, JG | - |
| dc.contributor.author | Kim, J | - |
| dc.contributor.author | Lee, JH | - |
| dc.date.accessioned | 2022-02-17T03:42:02Z | - |
| dc.date.available | 2022-02-17T03:42:02Z | - |
| dc.date.created | 2022-02-17 | - |
| dc.date.issued | 2005-06-20 | - |
| dc.identifier.issn | 0895-2477 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/25178 | - |
| dc.description.abstract | In this paper, we propose structures for noise- coupling reduction between adjacent packages and dense multichip modules (MCMs), which are classified as (i) grounded-moating and (ii) shielding structures, and (iii) a combination of them. Good agreeement from a 3D finite-element method (3D-FEM) electromagnetic characterization and experimental verification of each structure are presented. (c) 2005 Wiley Periodicals, Inc. | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | JOHN WILEY & SONS INC | - |
| dc.title | Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMS | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Lee, JH | - |
| dc.identifier.doi | 10.1002/mop.20878 | - |
| dc.identifier.scopusid | 2-s2.0-20444455426 | - |
| dc.identifier.wosid | 000229170100026 | - |
| dc.identifier.bibliographicCitation | MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.45, no.6, pp.557 - 559 | - |
| dc.relation.isPartOf | MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | - |
| dc.citation.title | MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | - |
| dc.citation.volume | 45 | - |
| dc.citation.number | 6 | - |
| dc.citation.startPage | 557 | - |
| dc.citation.endPage | 559 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Article | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalResearchArea | Optics | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.relation.journalWebOfScienceCategory | Optics | - |
| dc.subject.keywordAuthor | shielding | - |
| dc.subject.keywordAuthor | noise coupling | - |
| dc.subject.keywordAuthor | multichip modules | - |
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Related Researcher
- Lee, Jeong Hae
- Engineering (Electronic & Electrical Engineering)