Contact resistance of the chip-on-glass bonded 48Sn-52In solder joint
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, JH | - |
dc.contributor.author | Lee, KY | - |
dc.contributor.author | Jun, SW | - |
dc.contributor.author | Kim, YH | - |
dc.contributor.author | Oh, TS | - |
dc.date.accessioned | 2022-02-17T03:42:13Z | - |
dc.date.available | 2022-02-17T03:42:13Z | - |
dc.date.created | 2022-02-17 | - |
dc.date.issued | 2005-05 | - |
dc.identifier.issn | 1345-9678 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/25188 | - |
dc.description.abstract | An average contact resistance of a COG joint bonded with 48Sn-52In solder was characterized using daisy chain structure. The average contact resistances of the 48Sn-52In solder joint of 29 mu m diameter and 14 mu m height were 132 m Omega/bump. 28.5 m Omega/bump, and 8.6m Omega/bump on Ti(0.1 mu m)/Cu(1.5 mu m), Ti(0.1 mu m)/Cu(1.5 mu m)/Au(0.1 mu m), and Ti(0.1 mu m)/Cu(3 mu m)/Au(0.1 mu m) UBMs. respectively. Such difference in the average contact resistance of the 48Sn-52In solder joint on each UBM could be attributed to partial oxidation of the Cu UBM layer during solder evaporation and a difference of the thickness of the Cu UBM layer remaining underneath the intermetallic compounds after soldering. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | JAPAN INST METALS | - |
dc.subject | ANISOTROPIC CONDUCTIVE FILM | - |
dc.subject | FLIP-CHIP | - |
dc.subject | COG TECHNIQUE | - |
dc.subject | INTERCONNECTION | - |
dc.subject | RELIABILITY | - |
dc.subject | ALLOY | - |
dc.subject | BUMPS | - |
dc.title | Contact resistance of the chip-on-glass bonded 48Sn-52In solder joint | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Oh, TS | - |
dc.identifier.doi | 10.2320/matertrans.46.1042 | - |
dc.identifier.scopusid | 2-s2.0-22444433476 | - |
dc.identifier.wosid | 000229602200026 | - |
dc.identifier.bibliographicCitation | MATERIALS TRANSACTIONS, v.46, no.5, pp.1042 - 1046 | - |
dc.relation.isPartOf | MATERIALS TRANSACTIONS | - |
dc.citation.title | MATERIALS TRANSACTIONS | - |
dc.citation.volume | 46 | - |
dc.citation.number | 5 | - |
dc.citation.startPage | 1042 | - |
dc.citation.endPage | 1046 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | ANISOTROPIC CONDUCTIVE FILM | - |
dc.subject.keywordPlus | FLIP-CHIP | - |
dc.subject.keywordPlus | COG TECHNIQUE | - |
dc.subject.keywordPlus | INTERCONNECTION | - |
dc.subject.keywordPlus | RELIABILITY | - |
dc.subject.keywordPlus | ALLOY | - |
dc.subject.keywordPlus | BUMPS | - |
dc.subject.keywordAuthor | 48tin-52indium solder | - |
dc.subject.keywordAuthor | chip on glass | - |
dc.subject.keywordAuthor | flip chip | - |
dc.subject.keywordAuthor | soldcrjoint | - |
dc.subject.keywordAuthor | contact resistance | - |
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