비전도성 접착제를 이용한 COG 본딩용 Sn/Ag 범프에서 본딩 응력이 접속저항에 미치는 영향
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 이광용 | - |
dc.contributor.author | 오태성 | - |
dc.contributor.author | 이윤희 | - |
dc.contributor.author | 김영호 | - |
dc.date.accessioned | 2022-02-17T05:40:48Z | - |
dc.date.available | 2022-02-17T05:40:48Z | - |
dc.date.created | 2022-02-17 | - |
dc.date.issued | 2005 | - |
dc.identifier.issn | 1738-8228 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/25571 | - |
dc.description.abstract | Chip-on-glass bonding using onconductive adhesive was accomplished with joining of the Sn/Ag bumps, and the average contact resistance of the Sn/Ag bump was measured with variation of the bonding stress. Average contact resistance of the Sn/Ag bump could be obtained from the slope of the curve for daisy chain resistance vs. number of Sn/Ag bumps. With increasing the bonding stress from 31.8 MPa to 69.8 MPa, the average contact resistance decreased from 30 mΩ/bump to 15.6 mΩ/bump. With further increasing the bonding stress above 69.8 MPa, however, the average contact resistance changed little within the range of 12.9~15.6 mΩ/bump. Among the factors affecting the contact resistance with variation of the bonding stress, plastic deformation of the Sn/Ag bump had larger effect than the amount of the microvoids remaining at the contact interface between Sn/Ag bumps. | - |
dc.publisher | 대한금속·재료학회 | - |
dc.title | 비전도성 접착제를 이용한 COG 본딩용 Sn/Ag 범프에서 본딩 응력이 접속저항에 미치는 영향 | - |
dc.title.alternative | Effect of Bonding Stress on the Contact Resistance of the Sn/Ag Bump for Chip-on-Glass Bonding Using Non-conductive Adhesive | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | 오태성 | - |
dc.identifier.bibliographicCitation | 대한금속·재료학회지, v.43, no.3, pp.248 - 254 | - |
dc.relation.isPartOf | 대한금속·재료학회지 | - |
dc.citation.title | 대한금속·재료학회지 | - |
dc.citation.volume | 43 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 248 | - |
dc.citation.endPage | 254 | - |
dc.type.rims | ART | - |
dc.identifier.kciid | ART000939918 | - |
dc.description.journalClass | 2 | - |
dc.description.journalRegisteredClass | kci | - |
dc.subject.keywordAuthor | Electronic packaging | - |
dc.subject.keywordAuthor | Chip on glass | - |
dc.subject.keywordAuthor | Flip chip | - |
dc.subject.keywordAuthor | Sn Bump | - |
dc.subject.keywordAuthor | Contact resistance | - |
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