Alternating magnetic field crystallization of amorphous Si films
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kang, KH | - |
dc.contributor.author | Lee, SJ | - |
dc.contributor.author | Nam, SE | - |
dc.contributor.author | Kim, HJ | - |
dc.date.accessioned | 2022-02-18T07:43:01Z | - |
dc.date.available | 2022-02-18T07:43:01Z | - |
dc.date.created | 2022-02-18 | - |
dc.date.issued | 2004 | - |
dc.identifier.issn | 0255-5476 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/25834 | - |
dc.description.abstract | We propose a new method for lower process temperature and shorter process time of SPC. This method involves the induction of high frequency alternating magnetic field during crystallization annealing, referring this process as Alternating Magnetic Field Crystallization, AMFC. The processed films were characterized using UV spectroscopy to determine the incubation time, Raman spectroscopy for the degree of crystallization. We found that the kinetics of crystallization was greatly enhanced by alternating magnetic field. When we crystallized, in the case of SPC, annealing, time is over 14 hours at 570degreesC. But in the case of AMFC, annealing time is only 20 minutes at the same temperature. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | TRANS TECH PUBLICATIONS LTD | - |
dc.subject | DEPOSITED POLYCRYSTALLINE SILICON | - |
dc.subject | TEMPERATURE | - |
dc.subject | TRANSISTORS | - |
dc.subject | FABRICATION | - |
dc.title | Alternating magnetic field crystallization of amorphous Si films | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, HJ | - |
dc.identifier.doi | 10.4028/www.scientific.net/MSF.449-452.513 | - |
dc.identifier.wosid | 000189492000125 | - |
dc.identifier.bibliographicCitation | DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2, v.449-4, pp.513 - 516 | - |
dc.relation.isPartOf | DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2 | - |
dc.citation.title | DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2 | - |
dc.citation.volume | 449-4 | - |
dc.citation.startPage | 513 | - |
dc.citation.endPage | 516 | - |
dc.type.rims | ART | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Ceramics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | DEPOSITED POLYCRYSTALLINE SILICON | - |
dc.subject.keywordPlus | TEMPERATURE | - |
dc.subject.keywordPlus | TRANSISTORS | - |
dc.subject.keywordPlus | FABRICATION | - |
dc.subject.keywordAuthor | AMFC(Alternating Magnetic Field Crystallization) | - |
dc.subject.keywordAuthor | poly-Si | - |
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