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Reaction between Sn-In solder and under bump metallurgy
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Choi, JH | - |
| dc.contributor.author | Jung, BY | - |
| dc.contributor.author | Jun, SW | - |
| dc.contributor.author | Kim, YH | - |
| dc.contributor.author | Oh, TS | - |
| dc.date.accessioned | 2022-02-18T07:43:03Z | - |
| dc.date.available | 2022-02-18T07:43:03Z | - |
| dc.date.created | 2022-02-18 | - |
| dc.date.issued | 2004 | - |
| dc.identifier.issn | 0255-5476 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/25836 | - |
| dc.description.abstract | Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm Ti/8mum Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu. | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | TRANS TECH PUBLICATIONS LTD | - |
| dc.subject | CONDUCTIVE FILM | - |
| dc.title | Reaction between Sn-In solder and under bump metallurgy | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Oh, TS | - |
| dc.identifier.doi | 10.4028/www.scientific.net/MSF.449-452.401 | - |
| dc.identifier.scopusid | 2-s2.0-3142665593 | - |
| dc.identifier.wosid | 000189492000097 | - |
| dc.identifier.bibliographicCitation | DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2, v.449-4, pp.401 - 404 | - |
| dc.relation.isPartOf | DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2 | - |
| dc.citation.title | DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2 | - |
| dc.citation.volume | 449-4 | - |
| dc.citation.startPage | 401 | - |
| dc.citation.endPage | 404 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Article; Proceedings Paper | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Ceramics | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
| dc.subject.keywordPlus | CONDUCTIVE FILM | - |
| dc.subject.keywordAuthor | solder | - |
| dc.subject.keywordAuthor | chip on glass | - |
| dc.subject.keywordAuthor | 48Sn-52l | - |
| dc.subject.keywordAuthor | UBM | - |
| dc.subject.keywordAuthor | reflow | - |
| dc.subject.keywordAuthor | intermetallic compound | - |
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