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Reflow characteristics of Sn-Ag matrix in-situ composite solders
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, JH | - |
| dc.contributor.author | Park, DJ | - |
| dc.contributor.author | Heo, JN | - |
| dc.contributor.author | Lee, YH | - |
| dc.contributor.author | Shin, DH | - |
| dc.contributor.author | Kim, YS | - |
| dc.date.accessioned | 2022-04-14T05:41:44Z | - |
| dc.date.available | 2022-04-14T05:41:44Z | - |
| dc.date.created | 2022-04-14 | - |
| dc.date.issued | 2000-04-14 | - |
| dc.identifier.issn | 1359-6462 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/27371 | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
| dc.subject | CU | - |
| dc.title | Reflow characteristics of Sn-Ag matrix in-situ composite solders | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Lee, YH | - |
| dc.contributor.affiliatedAuthor | Kim, YS | - |
| dc.identifier.doi | 10.1016/S1359-6462(99)00392-9 | - |
| dc.identifier.wosid | 000086694800015 | - |
| dc.identifier.bibliographicCitation | SCRIPTA MATERIALIA, v.42, no.8, pp.827 - 831 | - |
| dc.relation.isPartOf | SCRIPTA MATERIALIA | - |
| dc.citation.title | SCRIPTA MATERIALIA | - |
| dc.citation.volume | 42 | - |
| dc.citation.number | 8 | - |
| dc.citation.startPage | 827 | - |
| dc.citation.endPage | 831 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Article | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
| dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
| dc.subject.keywordPlus | CU | - |
| dc.subject.keywordAuthor | reflow soldering | - |
| dc.subject.keywordAuthor | interface reaction | - |
| dc.subject.keywordAuthor | solder | - |
| dc.subject.keywordAuthor | intermetallic | - |
| dc.subject.keywordAuthor | composites | - |
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