Thermoelectric properties of the 0.05 wt.% SbI3-doped n-type Bi-2(Te0.95Se0.05)(3) alloy fabricated by the hot pressing method
DC Field | Value | Language |
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dc.contributor.author | Lee, SK | - |
dc.contributor.author | Oh, TS | - |
dc.contributor.author | Hyun, DB | - |
dc.contributor.author | Hwang, CW | - |
dc.date.accessioned | 2022-04-14T05:42:19Z | - |
dc.date.available | 2022-04-14T05:42:19Z | - |
dc.date.created | 2022-04-14 | - |
dc.date.issued | 2000-02 | - |
dc.identifier.issn | 1598-9623 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/27395 | - |
dc.description.abstract | Thermoelectric properties of the 0.05 wt.% SbI3-doped n-type Bi-2(Te0.95Se0.05)(3) alloy fabricated by hot pressing at temperatures ranging from 350 degrees C to 550 degrees C, were characterized. The electron concentration of the alloy decreased as the hot pressing temperature increased due to the annealing-out of the excess Te vacancies. When hot pressed at 350 degrees C, a figure-of-merit of 0.75x10(-3)/K was obtained due to the low Seebeck coefficient of -145 mu V/K and relatively high electrical resistivity of 2.05 m Ohm-cm. Upon increasing the hot pressing temperature, however, the figure-of-merit was improved mainly due to the increase of the Seebeck coefficient. A maximum figure-of-merit of 2.1x10(-3)/K was obtained by hot pressing at 550 degrees C. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | KOREAN INST METALS MATERIALS | - |
dc.subject | ANTISITE DEFECTS | - |
dc.subject | CRYSTALS | - |
dc.subject | BI2TE3 | - |
dc.title | Thermoelectric properties of the 0.05 wt.% SbI3-doped n-type Bi-2(Te0.95Se0.05)(3) alloy fabricated by the hot pressing method | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Oh, TS | - |
dc.identifier.doi | 10.1007/BF03026347 | - |
dc.identifier.wosid | 000085743300011 | - |
dc.identifier.bibliographicCitation | METALS AND MATERIALS INTERNATIONAL, v.6, no.1, pp.67 - 71 | - |
dc.relation.isPartOf | METALS AND MATERIALS INTERNATIONAL | - |
dc.citation.title | METALS AND MATERIALS INTERNATIONAL | - |
dc.citation.volume | 6 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 67 | - |
dc.citation.endPage | 71 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | ANTISITE DEFECTS | - |
dc.subject.keywordPlus | CRYSTALS | - |
dc.subject.keywordPlus | BI2TE3 | - |
dc.subject.keywordAuthor | bismuth telluride | - |
dc.subject.keywordAuthor | thermoelectric properties | - |
dc.subject.keywordAuthor | Peltier cooling | - |
dc.subject.keywordAuthor | figure-of-merit | - |
dc.subject.keywordAuthor | hot pressing | - |
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