Shear strength and aging characteristics of Sn-Pb and Sn-Ag-Bi solder bumps
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, JW | - |
dc.contributor.author | Oh, TS | - |
dc.date.accessioned | 2022-05-23T08:50:03Z | - |
dc.date.available | 2022-05-23T08:50:03Z | - |
dc.date.created | 2022-05-23 | - |
dc.date.issued | 2001 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/28021 | - |
dc.description.abstract | Ball shear strength and aging charcteristics of the 63Sn-37Pb solder bumps were characterized with variations of UBM finish (Au/Ni/Cu and Ni/Cu) and solder ball size (0.35 to 0.76 mm). Also, tensile strength, ball shear strength, and aging characteristics of the Sn-3.5Ag-Bi solder alloys were investigated. When formed on Au/Ni/Cu UBM, ball shear strength of the 63Sn-37Pb solder bumps of 0.35 mm size was higher than those of the 0.62 and 0.76 mm sizes due to precipication hardening of Au-Sn intermetallic compounds. When the bump size was identical, the 63Sn-37Pb solder bumps exhibited higher shear strength on Au/Ni/Cu UBM than on Ni/Cu UBM. Shear strength of the 63Sn-37Pb solder bumps formed on Ni/Cu UBM was little varied with aging at 150degreesC up to 1000 hours. With increasing the aging time, the failure mode of the 63Sn-37Pb solder bumps on Au/Ni/Cu UBM was changed from ductile fracture (solder failure) to brittle fracture (interface failure). The 63Sn-37Pb solder bumps on Ni/Cu UBM showed ductile fracture regardless of the aging time up to 1000 hours. Tensile strength of the Sn-3.5Ag-Bi alloys increased with increasing the Bi content up to 9 wt%. Ball shear strength of the Sn-3.5Ag-Bi solder bumps increased with increasing the Bi content and reached maximum at 5-7 wt% Bi. Shear strength of the Sn-3.5Ag-5Bi solder bumps increased substatially from 70 MPa to 84 MPa by aging at 150degreesC for 300 hours. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | IEEE | - |
dc.subject | METALLIZATION | - |
dc.subject | FATIGUE | - |
dc.subject | JOINTS | - |
dc.title | Shear strength and aging characteristics of Sn-Pb and Sn-Ag-Bi solder bumps | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Oh, TS | - |
dc.identifier.doi | 10.1109/EMAP.2001.984023 | - |
dc.identifier.wosid | 000175586500077 | - |
dc.identifier.bibliographicCitation | ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, pp.433 - 437 | - |
dc.relation.isPartOf | ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001 | - |
dc.citation.title | ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001 | - |
dc.citation.startPage | 433 | - |
dc.citation.endPage | 437 | - |
dc.type.rims | ART | - |
dc.type.docType | Proceedings Paper | - |
dc.description.journalClass | 3 | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Manufacturing | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.subject.keywordPlus | METALLIZATION | - |
dc.subject.keywordPlus | FATIGUE | - |
dc.subject.keywordPlus | JOINTS | - |
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