FORMATION OF METAL INTERCONNECTS AND THEIR RESISTANCE-CHANGE BEHAVIOR DURING TENSILE STRETCHING FOR STRETCHABLE PACKAGING APPLICATIONS
DC Field | Value | Language |
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dc.contributor.author | Park, Donghyun | - |
dc.contributor.author | Park, Dae Ung | - |
dc.contributor.author | Han, Kee-Sun | - |
dc.contributor.author | Shin, Soo Jin | - |
dc.contributor.author | Oh, Hyun-Ah | - |
dc.contributor.author | Oh, Tae Sung | - |
dc.contributor.author | Choi, Jung-Yeol | - |
dc.contributor.author | Hynix, S. K. | - |
dc.date.accessioned | 2022-06-14T01:40:43Z | - |
dc.date.available | 2022-06-14T01:40:43Z | - |
dc.date.created | 2022-06-14 | - |
dc.date.issued | 2016 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/28210 | - |
dc.description.abstract | We examined the resistance-change behavior of thin Pt and Au films on the PDMS elastomeric substrate. A maximum Young's modulus of 1.74 MPa was obtained for the PDMS substrate by adjusting the mixing ratio between base polymer and its curing agent to 10:1. Parylene coating on the PDMS surface was effective as an adhesion layer between metal interconnects and PDMS substrate. Without a Parylene coating, the resistance of a 150 nm-thick Pt film increased from 18.7 Omega to 3000 Omega with stretching to 20% strain and became open at strains larger than 20%. On the other hand, the resistance of a Pt film, sputtered on a Parylene-treated PDMS, was initially 10.3 Omega before loading, increased to 99.3 Omega at 30% elongation, and then decreased to 23.8 Omega after complete unloading. Thin Au metallization has better resistance properties for stretchable interconnect applications than Pt thin film. The resistance of a 150 nm-thick Au film on a Parylene-coated PDMS substrate was 1.3 Omega before loading, increased to 19 Omega at 30% elongation, and then returned to 1.3 Omega after complete unloading. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | IEEE | - |
dc.subject | GOLD | - |
dc.title | FORMATION OF METAL INTERCONNECTS AND THEIR RESISTANCE-CHANGE BEHAVIOR DURING TENSILE STRETCHING FOR STRETCHABLE PACKAGING APPLICATIONS | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Oh, Tae Sung | - |
dc.identifier.wosid | 000386185100037 | - |
dc.identifier.bibliographicCitation | 2016 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC) | - |
dc.relation.isPartOf | 2016 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC) | - |
dc.citation.title | 2016 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC) | - |
dc.type.rims | ART | - |
dc.type.docType | Proceedings Paper | - |
dc.description.journalClass | 3 | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.subject.keywordPlus | GOLD | - |
dc.subject.keywordAuthor | Stretchable packaging | - |
dc.subject.keywordAuthor | flexible packaging | - |
dc.subject.keywordAuthor | PDMS | - |
dc.subject.keywordAuthor | Parylene coating | - |
dc.subject.keywordAuthor | Pt film | - |
dc.subject.keywordAuthor | Au film | - |
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