Bump formation and flip chip processes for RF system-on-packages

Abstract

For flip-chip process of RF system-on-packages(SOP), double bump bonding processes were investigated. Sn-Ag and Sri solder joints were formed by the reflowed double bumping process, and Sn/In/Sn bump joints were fabricated by the non-reflowed double bump bonding process. The height-to-size ratios of 0.78 and 0.65 were obtained for the reflowed double bumping and the non-reflowed bumping, respectively. Average contact resistance of the reflowed Sn-Ag and Sri solder joints was about 13m Omega which was much lower than 24 similar to 33m Omega of the non-reflowed Sn/In/Sn bump joints. The reflowed solder double bumping method is more suitable for flip-chip process of RF-SOP than the non-reflowed double bump bonding.