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Development of W-curable paste for micro mold transfer process of barrier ribs of PDPs

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dc.contributor.authorKim, Yoo-Seong-
dc.contributor.authorKoh, Tae-geum-
dc.contributor.authorKim, Yong-Seog-
dc.date.accessioned2022-07-07T07:41:04Z-
dc.date.available2022-07-07T07:41:04Z-
dc.date.created2022-07-07-
dc.date.issued2006-
dc.identifier.issn1738-7558-
dc.identifier.urihttps://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/30020-
dc.description.abstractIn cut attempt to reduce processing cost and to improve resolution of PDPs, micro mold transfer processing route for barrier ribs of plasma display panel was developed. In this study, the parameters that may cause defects during the process were identified, which include the shrinkage during UV curing process, stress due to evaporation of organic components, and sintering shrinkage. Considering such parameters, UV cut-able paste was developed and barrier ribs of PDPs were successfully processed via the process. In addition, the process was successfully applied for the processing of barrier ribs with embedded counter electrodes.-
dc.language영어-
dc.language.isoen-
dc.publisherKOREAN INFORMATION DISPLAY SOC-
dc.titleDevelopment of W-curable paste for micro mold transfer process of barrier ribs of PDPs-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Yong-Seog-
dc.identifier.wosid000259669300202-
dc.identifier.bibliographicCitationIMID/IDMC 2006: THE 6TH INTERNATIONAL MEETING ON INFORMATION DISPLAY/THE 5TH INTERNATIONAL DISPLAY MANUFACTURING CONFERENCE, DIGEST OF TECHNICAL PAPERS, pp.917 - 920-
dc.relation.isPartOfIMID/IDMC 2006: THE 6TH INTERNATIONAL MEETING ON INFORMATION DISPLAY/THE 5TH INTERNATIONAL DISPLAY MANUFACTURING CONFERENCE, DIGEST OF TECHNICAL PAPERS-
dc.citation.titleIMID/IDMC 2006: THE 6TH INTERNATIONAL MEETING ON INFORMATION DISPLAY/THE 5TH INTERNATIONAL DISPLAY MANUFACTURING CONFERENCE, DIGEST OF TECHNICAL PAPERS-
dc.citation.startPage917-
dc.citation.endPage920-
dc.type.rimsART-
dc.type.docTypeProceedings Paper-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
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