Stretchable Characteristics of Thin Au Film on Polydimethylsiloxane Substrate with Parylene Intermediate Layer for Stretchable Electronic Packaging

Abstract

Thin Au films with thickness of 150 nm could be reversibly stretched up to 30% elongation on polydimethylsiloxane (PDMS) substrate with 150-nm-thick Parylene C deposited as intermediate layer instead of a Cr adhesion layer. Prestretching of the Parylene-deposited PDMS was effective to suppress the resistance increase of Au films during their tensile elongation. While the resistance change rate Delta R/R (0) of the Au film at 30% elongation was 11 without prestretching of the Parylene-deposited PDMS, it was substantially suppressed to 0.4 with 30% prestretching of the Parylene-deposited PDMS.