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Results 1-2 of 2 (Search time: 0.004 seconds).
Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages
Park, JH; Lee, JH; Lee, Y; Kim, YS
Article
Issue Date
2002
Citation
JOURNAL OF ELECTRONIC MATERIALS, v.31, no.11, pp.1175 - 1180
Publisher
SPRINGER
Kinetics of intermetallic formation at Sn-37Pb/Cu interface during reflow soldering
Lee, JH; Kim, YS
Article
Issue Date
2002
Citation
JOURNAL OF ELECTRONIC MATERIALS, v.31, no.6, pp.576 - 583
Publisher
SPRINGER
1
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Author
이용호
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CU
2
EUTECTIC SNPB
2
NUMERICAL-METHOD
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Au/Sn
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CIRCUIT PLC PLATFORM
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Co
1
Cu dissolution
1
DISSOLUTION
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INTERFACE
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interface reaction
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