한국어
LIBRARY
Communities & Collections
Researchers
Titles
Issue Date
Journals
검색
Search
All of ScholarWorks
College of Engineering
Chemical Engineering Major
Civil Engineering Major
Civil and Environmental Engineering
Computer Engineering
Computer Engineering Major
Department of Civil Engineering
Department of Mechanical and System Design Engineering
Department of Science
ETC
Engineering
Industrial Engineering Major
Industrial and Data Engineering
Materials Science and Engineering Major
School of Electronic & Electrical Engineering
Urban Engineering Major
Current filters:
Title
Author
Subject
Date Issued
Type
Language
Journal
Journal Index
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Current filters:
Title
Author
Subject
Date Issued
Type
Language
Journal
Journal Index
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Current filters:
Title
Author
Subject
Date Issued
Type
Language
Journal
Journal Index
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Add filters:
Title
Author
Subject
Date Issued
Type
Language
Journal
Journal Index
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Results/Page
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
Sort items by
Relevance
Title
Issue Date
In order
Ascending
Descending
Authors/record
All
1
5
10
15
20
25
30
35
40
45
50
Results 1-1 of 1 (Search time: 0.004 seconds).
Flip chip process using the Cu-Sn-Cu double-pillar-bump bonding
Choi, J.-Y.; Kim, M.-Y.; Oh, T.-S.
Article
Issue Date
2009
Citation
Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009, pp.1024 - 1027
1
Discover
Subject
Chip shear force
1
Contact resistance
1
Cu pillar bump
1
Double pillar bump
1
RF package
1
Date Issued
2009
1
Type
Article
1
Language
English
1
BROWSE
한국어
Communities & Collections
Researchers
Titles
Journals
LIBRARY