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고출력 LED 패키지의 Thermal Via 형성을 위한 Si 기판의 이방성 습식식각 공정
유병규; 김민영; 오태성
Article
Issue Date
2012
Citation
마이크로전자 및 패키징학회지, v.19, no.4, pp.51 - 56
Publisher
한국마이크로전자및패키징학회
1
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Subject
LED
1
thermal via
1
through-Si-via
1
TMAH
1
Journal
마이크로전자 및 패키징학회지
1
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