Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates
DC Field | Value | Language |
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dc.contributor.author | Park, Donghyun | - |
dc.contributor.author | Han, Kee-Sun | - |
dc.contributor.author | Oh, Tae Sung | - |
dc.date.available | 2020-07-10T05:41:23Z | - |
dc.date.created | 2020-07-06 | - |
dc.date.issued | 2017 | - |
dc.identifier.issn | 1345-9678 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/6962 | - |
dc.description.abstract | The contact resistance and microstructure of the flip-chip joints processed using anisotropic conductive adhesive (ACA) were characterized on flexible printed-circuit-board (FPCB) and stretchable FPCB/polydimethylsiloxane (FPCB/PDMS) substrates. On the FPCB substrate, the contact resistance was remarkably reduced from 56.9 m Omega to 13.3 m Omega when the bonding pressure increased from 10 MPa to 200 MPa. However, at a bonding pressure of 300 MPa, it substantially increased to 74.8 m Omega with an excessive deviation of +/- 37.7 m Omega. On the more compliant FPCB/PDMS substrate, the contact resistance decreased from 43.2 m Omega to 31.2 m Omega when the bonding pressure increased from 10 MPa to 50 MPa. Severe distortion of the FPCB/PDMS substrate occurred at bonding pressures above 50 MPa because of the softness of the PDMS. A more compliant substrate has a lower appropriate bonding pressure for the flip-chip process. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | JAPAN INST METALS & MATERIALS | - |
dc.subject | INTERCONNECTS | - |
dc.title | Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Oh, Tae Sung | - |
dc.identifier.doi | 10.2320/matertrans.M2017066 | - |
dc.identifier.scopusid | 2-s2.0-85026388858 | - |
dc.identifier.wosid | 000410587600020 | - |
dc.identifier.bibliographicCitation | MATERIALS TRANSACTIONS, v.58, no.8, pp.1217 - 1222 | - |
dc.relation.isPartOf | MATERIALS TRANSACTIONS | - |
dc.citation.title | MATERIALS TRANSACTIONS | - |
dc.citation.volume | 58 | - |
dc.citation.number | 8 | - |
dc.citation.startPage | 1217 | - |
dc.citation.endPage | 1222 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | INTERCONNECTS | - |
dc.subject.keywordAuthor | stretchable electronic packaging | - |
dc.subject.keywordAuthor | wearable device | - |
dc.subject.keywordAuthor | substrate stiffness | - |
dc.subject.keywordAuthor | flip chip | - |
dc.subject.keywordAuthor | contact resistance | - |
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