ScholarWorks@Hongik: Journal : IEEE Transactions on Components and Packaging Technologies

IEEE Transactions on Components and Packaging Technologies

Journal Title

IEEE Transactions on Components and Packaging Technologies

ISSN

P 1521-3331 | 1521-3331

Publisher

Institute of Electrical and Electronics Engineers
IEEE

Listed on(Coverage)

JCR	1999-2010
SJR	2000-2013
SCI	2010-2011
SCIE	2010-2011
SCOPUS	2017-2020

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Article List

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Flip-Chip Process Using Interlocking-Bump Joints

Oh, Tae-Sung; Lee, Kwang-Yong; Won, Hye-Jin

ArticleIssue Date2009CitationIEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.32, no.4, pp.909 - 914PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

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