ScholarWorks@Hongik: Journal : 마이크로전자 및 패키징학회지

마이크로전자 및 패키징학회지

Journal Title

마이크로전자 및 패키징학회지

ISSN

P 1226-9360

Publisher

한국마이크로전자및패키징학회

Listed on(Coverage)

KCI(Ranking)	2009-2019
KCI	2004-2021
KCI(Candidate)	2001-2003

Active

Active
based on the information
- KCI(Ranking);KCI;

Country

SOUTH KOREA

Article List

41 - 42 out of 42 results.

플립칩 본딩된 Sn-3.5Ag-0.5Cu 솔더범프의 electromigration 거동

최재훈; 전성우; 원혜진; 정부양; 오태성

ArticleIssue Date2004Citation마이크로전자 및 패키징학회지, v.11, no.4, pp.43 - 48Publisher한국마이크로전자및패키징학회

플립칩 패키지내 Sn-3.5Ag 솔더범프의 electromigration

이서원; 오태성

ArticleIssue Date2003Citation마이크로전자 및 패키징학회지, v.10, no.4, pp.13 - 86Publisher한국마이크로전자및패키징학회

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