ScholarWorks@Hongik: Shin, Seungwon

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Shin, Seungwon (신승원)

Engineering (Mechanical & System Design Engineering)

Research Area: 다상유동 수치해석, 표면장력 문제, 동적 접촉각 문제, Numerical Simulation of Multiphase Flow, Surface Tension, Contact Line Dynamics

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Numerical simulation:18||Multiphase flow:12||multiphase flow:11||Droplet impact:7||numerical simulation:6||Front tracking:5||drops:5||Twophase flow:4||front tracking:3||Thermal deformation:3||Mixing:3||capillary flows:3||Direct numerical simulation:3||Faraday waves:3||pattern formation:3||Particulate flow:2||Stamping process:2||curvature:2||Static mixer:2||Concentrated solar flux:2||가스제거(bubble displacement):2||Interface dynamics:2||DNS:2||Porous medium:2||Porous structure:2||Prediction model:2||Concentrated solar power:2||CFD):2||동적 접촉각(dynamic contact angle):2||jets:2||LCRM(Level Contour Reconstruction Method):2||초소수성 표면:2||마이크로 직접 메탄올 연료전지(μDMFC):2||level set:2||Multiphase mixing:2||LES:2||Bubble rising:2||Level contour reconstruction method:2||Level set:2||Design of experiments:2||Numerical analysis:2||수치 해석(Numerical Analysis):2||Fronttracking method:2||수치해석:2||수치해석(Numerical Simulation):2||수치해석(numerical simulation):2||실리콘 태양전지:2||Solar receiver:2||Optimization:2||Maximum temperature:2||breakup/coalescence:2||bubble dynamics:2||surface tension:2||Parametric study:2||Particle heating receiver:2||Dynamic Thermal Management:1||Dynamic analysis:1||Dynamic behavior:1||Dynamic contact angle:1||Dynamic thermal management (DTM):1||Ellipta:1||Energy Analysis:1||Energy network:1||Ergonomics:1||EulerianGranular method:1||Eulerianbased formulation:1||Exergy analysis:1||Experimental analysis:1||Falling films:1||Fastmoving consumer goods:1||Film Delamination:1||Fine Dust Mask:1||Fluid–structure interaction:1||Front Tracking:1||Front Tracking method:1||Front Tracking(계면추적법):1||Fronttracking:1||Ghost point method:1||Granular flow:1||Growth from melt:1||HRSG system:1||Heat pump:1||Heat transfer:1||Hydrophilic surface:1||Hydrophobic surface:1||IML:1||Impact force:1||Inmold Labeling:1||Inhaler usage:1||Initial Contact Angle:1||Injection Molding:1||Interaction design:1||IoT:1||Jet:1||Jets:1||Level Contour Reconstruction Method:1||Level Set method:1||Local mass conservation:1||Longitudinal pitch:1||Machine learning:1||Manufacturing:1||Microscale grinding process:1||Microfabrication:1||Midair collision:1||Modeling:1||Multicore:1||Multiphase flow simulation:1||Multiphase flows:1||Nanofluid Minimum Quantity Lubrication (MQL):1||Nd:YAG laser:1||Neural network:1||Numerical
Simulation(수치 해석):1||Numerical Analysis:1||Numerical Simulation:1||Numerical modeling:1||Oilwater emulsion:1||Oilwater separation:1||Pancakes:1||Parallel or distributed processing:1||Phase change process:1||Plugs:1||Polycrystalline:1||Polycrystalline Si thin films:1||Realtime correction:1||Recrystallized layer:1||Residual Stress:1||Retraction dynamics:1||Semiconducting silicon:1||Sensing Inhalation:1||Sharp Interface Method:1||Sharp Interface Method(예면경계법):1||Sharp energy method:1||Sharp interface method:1||Silicon Solar Cell:1||Simulation:1||Simulink:1||Solar cells:1||Solid Liquid Interface:1||Solidification:1||Soluble surfactant:1||Sound Absorber:1||Sound Masking:1||Spherical particle:1||Spherical particle, multiphase flow:1||Spreading time:1||Stirred vessels:1||Superhydrophobic Surface:1||Superhydrophobic surface:1||Surface tension:1||Surfactant:1||Surfactantladen:1||Temperatureaware Microprocessor:1||Thermal Expansion Rate:1||Thermal Impact:1||Thermal characteristics:1||Thermal energy storage:1||Thermal imaging:1||Thermal model:1||Three dimensional:1||Tic Disorders:1||Top free surface:1||Tourettes Syndrome:1||Transverse pitch:1||Tube bank:1||Turbulence:1||UX:1||Ultrathin crystalline silicon solar cell:1||Ultrathin silicon solar cell:1||Unbaffled stirred mixer:1||Viscous folding:1||ambient temperature:1||architectural investigation:1||capillary waves:1||compact stellarator:1||computational fluid dynamics:1||computational methods:1||cylinder array:1||design of experiment:1||divertor:1||divertors:1||evaporation:1||fluidstructure interaction:1||fronttracking method:1||helium coolant:1||high heat flux:1||injection molding:1||interface reconstruction:1||jet flow:1||laser materials processing:1||liquid cooling:1||lowReynoldsnumber flow:1||magnetic fusion energy:1||map of outcome regimes:1||melting:1||metalworking:1||microarchitectural thermal simulation:1||microfluidics:1||numerical analysis:1||parametric instability:1||parasitic current:1||parasitic currents:1||particle/fluid flows:1||regression:1||residual stress:1||solid stress:1||solidification:1||spherical particle:1||stellarators:1||tetramarching:1||thermal deformation:1||thermal management:1||thin films:1||tungsten alloy:1||vortex interactions:1||가상 경계법(Fictitious Domain Method):1||가상경계법(Immersed Boundary Method):1||계면활성제(Surfactant):1||곡선 접합:1||공기차단막:1||관군(Tube Bank):1||기름 박리(Oil peeling):1||다공성 구조물:1||다공성 물질(Porous media):1||다상유동:1||다상입자유동(Particulated multiphase flow):1||덕트 유동(Duct Flow):1||동적 온도 제어:1||래쳇구조(Ratchet Structure):1||레이저용접(Laser Welding):1||마란고니 대류(Marangoni Convection):1||모델링:1||미세먼지 마스크:1||벤치마킹(Benchmarking):1||보조기구:1||사물인터넷:1||사운드 마스킹:1||사출성형:1||상계면 추적(Front Tracking):1||소수성 표면:1||속도보간(Velocity Interpolation):1||수치모델 (Numerical modeling):1||시뮬레이션:1||실린더 벽면:1||압력 강하(Pressure Drop):1||액적 충돌:1||액적(Droplet):1||액적점핑:1||에너지 분석:1||엔탈피 방법(Enthalpy Method):1||열유속 분포(Heat flux distribution):1||열전달 계수(Heat Transfer Coefficient):1||열충격:1||열팽창률:1||열회수보일러(HRSG):1||온도 균일성(Temperature Uniformity):1||온도 인지 마이크로프로세서:1||외부 진동(External Vibration):1||용융풀(Weld Pool):1||움직이는 고체(Moving Rigid Object):1||유수분리:1||유체 구조 연성(Fluid Structure Interaction):1||유한차분(finite difference):1||인체공학:1||잔류응력:1||전산유체역학:1||전산유체역학(Computational Fluid Dynamic:1||전산유체역학(Computational Fluid Dynamics:1||전산유체해석:1||전치 가이드 베인(Inlet Guide Vane):1||접 수치해석(Direct Numerical Simulation):1||제트유동:1||제품 생산:1||종간 간격(Longitudinal Pitch):1||직접 수치 해석(Direct Numerical Simulation):1||직접강제방법(Direct Forcing):1||집광형 태양열 발전(Concentrating Solar Power:1||천식 흡입기:1||초기접촉각:1||친수성 표면:1||친수표면(Hydrophilic surface):1||태양열발전 흡수기(Solar thermal absorber):1||투렛 증후군:1||틱 장애:1||필름박리:1||횡간 간격(Transverse Pitch):1||휨 현상:1||흡음재:1||2유체 유동(Twophase flow):1||흡입 감지 센서:1||3D Image Scanner:1||3D image scanner:1||3D integration:1||3상유동(3phase Flow):1||AWeighting Analysis:1||A가중치분석:1||Adaptive interface reconstruction:1||Aeration:1||Air Shield:1||Amorphous Si thin films:1||Arbitrary geometry:1||Artificial intelligence:1||Assistant Device:1||Assistant device:1||Asthma:1||Asthma Inhaler:1||Asymmetric spreading:1||Automotive body part:1||Bow Phenomenon:1||Bow phenomenon:1||Bowing phenomenon:1||Bubble interaction:1||CFD:1||CO2 emission:1||CSC:1||CSP):1||Computational Fluid Dynamics:1||Computer Fluid Dynamics:1||Contact angle:1||Contact line dynamics:1||Contact line modeling:1||Continuous Strip Casting:1||Convective Flow:1||Convective Flow(대류 유동):1||Convective flow:1||Crossjunction:1||Crystallization:1||Curved superhydrophobic surface:1||Cylindrical wall:1||DOE analysis:1||DPI (Dry Powder Inhaler):1||Data regression:1||Datadriven analysis:1||Deformable solid:1||Dendrite(수치상결정):1||Dendritic Solidification:1||Dendritic solidification:1||Direct numerical simulations:1||District energy network system:1||District heating:1||Diverging microchannel:1||Droplet Jumping:1||Droplet breakup:1||Drops:1||

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