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휴대폰 보호필름 부착 가이드의 변형 최소를 위한 사출성형 최적 설계

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dc.contributor.authorJong Cheon Park-
dc.date.available2021-02-26T05:42:06Z-
dc.date.created2021-02-19-
dc.date.issued2020-11-06-
dc.identifier.urihttps://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/18708-
dc.publisher한국기계가공학회-
dc.title휴대폰 보호필름 부착 가이드의 변형 최소를 위한 사출성형 최적 설계-
dc.title.alternativeOptimization of Injection Molding Design for Minimal Deformation of Mobile Phone Protective Film Attachment Guide-
dc.typeConference-
dc.contributor.affiliatedAuthorJong Cheon Park-
dc.identifier.bibliographicCitation2020 한국기계가공학회 추계학술대회, v.1, no.1, pp.282-
dc.relation.isPartOf2020 한국기계가공학회 추계학술대회-
dc.relation.isPartOf2020 한국기계가공학회 추계학술대회 논문집-
dc.citation.title2020 한국기계가공학회 추계학술대회-
dc.citation.volume1-
dc.citation.number1-
dc.citation.startPage282-
dc.citation.endPage282-
dc.citation.conferencePlace대한민국-
dc.citation.conferencePlace여수 히든베이 호텔 + 온라인 병행-
dc.type.rimsCONF-
dc.description.journalClass2-
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