Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Wafer Packing Box 안정화 설계Design Alterations of a Packing Box for the Semiconductor Wafer to Improve Stability
- Other Titles
- Design Alterations of a Packing Box for the Semiconductor Wafer to Improve Stability
- Issue Date
- Mar-2022
- Publisher
- 한국반도체디스플레이기술학회
- Keywords
- Semiconductor Wafer; Wafer Packaging Box; Design Alteration of the Supporting Structure; Vibration Suppression; Stability Improvement
- Citation
- 반도체디스플레이기술학회지, v.21, no.1, pp.62 - 66
- Journal Title
- 반도체디스플레이기술학회지
- Volume
- 21
- Number
- 1
- Start Page
- 62
- End Page
- 66
- ISSN
- 1738-2270
- Abstract
- Semiconductor is one of the most internationally competitive areas among domestic industries, the major concern of which is the stability of the wafer manufacturing processes. The packaging process is the final step in wafer manufacturing. Problems in the wafer packaging process cause large losses. The vibrations are supposed to be the most important factors for the packaging quality. In this study, the structure of a packaging box was analyzed through experiments and computer simulations, and further the effects of design alterations to suppress the vibrations have been investigated. The final result shows that the vibrations can be reduced substantially to improve the stability of the structure.
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - School of Mechanical System Engineering > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Hur, Jang Wook
- College of Engineering (School of Mechanical System Engineering)