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스퍼터링 및 전기도금법으로 증착된 Cu 박막의 두께에 따른 어닝링 집합조직

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dc.contributor.author이상훈-
dc.contributor.author박노진-
dc.date.accessioned2023-12-11T11:30:37Z-
dc.date.available2023-12-11T11:30:37Z-
dc.date.issued2006-
dc.identifier.issn1738-8228-
dc.identifier.issn2288-8241-
dc.identifier.urihttps://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/22833-
dc.format.extent6-
dc.publisher대한금속·재료학회-
dc.title스퍼터링 및 전기도금법으로 증착된 Cu 박막의 두께에 따른 어닝링 집합조직-
dc.title.alternativeTexture Evolution According to the Film Thickness of Annealed Cu Films Depositedby Sputtering and Electro-deposition-
dc.typeArticle-
dc.publisher.location대한민국-
dc.identifier.bibliographicCitation대한금속·재료학회지, v.44, no.8, pp 556 - 561-
dc.citation.title대한금속·재료학회지-
dc.citation.volume44-
dc.citation.number8-
dc.citation.startPage556-
dc.citation.endPage561-
dc.identifier.kciidART001020971-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClasskci-
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