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반응표면법을 이용한 이종재질의 접합 계면부 강도평가 및 접합특성에 관한 연구
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이승현 | - |
| dc.contributor.author | 김기만 | - |
| dc.contributor.author | 이종형 | - |
| dc.contributor.author | 최성대 | - |
| dc.date.accessioned | 2023-12-11T12:00:30Z | - |
| dc.date.available | 2023-12-11T12:00:30Z | - |
| dc.date.issued | 2009 | - |
| dc.identifier.issn | 1598-6721 | - |
| dc.identifier.issn | 2288-0771 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/22984 | - |
| dc.description.abstract | In this papers, Study on the Bonding property and Strength Evaluation in Bonding interface Joints of Dissimilar material using DOE. We found optimal condition that uses experimental design method (Response Surface Analysis, DOE) used temperature, pressure, time on experiment factor. And we could get bonding condition and strength that break and crack do not happen in mechanical processing about united dissimilar material. And progress 3 point bending tests and verified result. | - |
| dc.format.extent | 7 | - |
| dc.language | 한국어 | - |
| dc.language.iso | KOR | - |
| dc.publisher | 한국기계가공학회 | - |
| dc.title | 반응표면법을 이용한 이종재질의 접합 계면부 강도평가 및 접합특성에 관한 연구 | - |
| dc.title.alternative | Study on the Bonding Property and Strength Evaluation in Bonding Interface Joints of Dissimilar Material using Response Surface Analysis | - |
| dc.type | Article | - |
| dc.publisher.location | 대한민국 | - |
| dc.identifier.bibliographicCitation | 한국기계가공학회지, v.8, no.2, pp 68 - 74 | - |
| dc.citation.title | 한국기계가공학회지 | - |
| dc.citation.volume | 8 | - |
| dc.citation.number | 2 | - |
| dc.citation.startPage | 68 | - |
| dc.citation.endPage | 74 | - |
| dc.identifier.kciid | ART001352121 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | kciCandi | - |
| dc.subject.keywordAuthor | Dissimilar material(이종 재질) | - |
| dc.subject.keywordAuthor | Ceramics dielectric material (세라믹 유전체) | - |
| dc.subject.keywordAuthor | Response Surface Analysis | - |
| dc.subject.keywordAuthor | DOE(반응 표면법) | - |
| dc.subject.keywordAuthor | Adhesive(접합제) | - |
| dc.subject.keywordAuthor | Bonding Interface(접합 계면) | - |
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