휴대폰 카메라 모듈의 조립공차 개선 시스템에 관한 연구

Abstract

Tolerance analysis is one of the most important processes to improve the image quality of products. High resolution camera module for mobile phones needs precision assembly technology since the module becomes smaller and thinner. This paper will focus on the unit tolerance and the assembly tolerance which can affect the performance of the module. Lens shading and relative illumination were used to evaluate the optical axis scatter for each component on camera and estimate the assembly yield rate based on the evaluation result. A program was developed to analyze the impact on optical axis by each module, then to optimize the dimensions and tolerance for reducing the scatter of optical axis assembly. Through the simulation, though a rate of relative illumination was declined in where optical axis is displaced 100㎛ from sensor center, MTF performance is not influenced by increasing in optical axis displacement. It was seen that assembly yield was improved in result of simulation after correcting optical axis tolerance