태양전지용 실리콘 웨이퍼의 멀티 와이어 쏘잉 시절삭저항력에 관한 연구
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 황인환 | - |
dc.contributor.author | 박상현 | - |
dc.contributor.author | 안국진 | - |
dc.contributor.author | 권대근 | - |
dc.contributor.author | 이종찬 | - |
dc.date.accessioned | 2023-12-11T12:30:39Z | - |
dc.date.available | 2023-12-11T12:30:39Z | - |
dc.date.issued | 2016 | - |
dc.identifier.issn | 1598-6721 | - |
dc.identifier.issn | 2288-0771 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/23468 | - |
dc.description.abstract | Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe. | - |
dc.format.extent | 6 | - |
dc.language | 한국어 | - |
dc.language.iso | KOR | - |
dc.publisher | 한국기계가공학회 | - |
dc.title | 태양전지용 실리콘 웨이퍼의 멀티 와이어 쏘잉 시절삭저항력에 관한 연구 | - |
dc.title.alternative | A Study on Cutting Force during Multi Wire Sawing of Silicon Wafers for Solar Cells | - |
dc.type | Article | - |
dc.publisher.location | 대한민국 | - |
dc.identifier.doi | 10.14775/ksmpe.2016.15.3.066 | - |
dc.identifier.bibliographicCitation | 한국기계가공학회지, v.15, no.3, pp 66 - 71 | - |
dc.citation.title | 한국기계가공학회지 | - |
dc.citation.volume | 15 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 66 | - |
dc.citation.endPage | 71 | - |
dc.identifier.kciid | ART002114507 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | kci | - |
dc.subject.keywordAuthor | Multi Wire Sawing Machine(멀티 와이어 쏘잉 장비) | - |
dc.subject.keywordAuthor | Diamond Wire Saw(다이아몬드 와이어 쏘) | - |
dc.subject.keywordAuthor | Cutting Force(절삭력) | - |
dc.subject.keywordAuthor | Silicon Ingot(실리콘 잉곳) | - |
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