Development of adhesion force evaluation equipment for nano diamond coated tool using shear method
- Authors
- Li, Jinghua; Lee, SoJin; Kweon, HyunKyu
- Issue Date
- Jan-2021
- Publisher
- SAGE PUBLICATIONS LTD
- Keywords
- Nano-diamond coated tool; thin-film; adhesion force; frictional force; characteristic; vibration
- Citation
- MEASUREMENT & CONTROL, v.54, no.1-2, pp 3 - 10
- Pages
- 8
- Journal Title
- MEASUREMENT & CONTROL
- Volume
- 54
- Number
- 1-2
- Start Page
- 3
- End Page
- 10
- URI
- https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/26437
- DOI
- 10.1177/0020294020977890
- ISSN
- 0020-2940
2051-8730
- Abstract
- In this study, we have developed a thin film adhesion evaluation system for diamond coating tool, which is mainly used for CFRP processing. CFRP is widely used in aviation and automobile industries. Because of the high surface hardness of the diamond coating tool, it is difficult to evaluate the adhesive strength of the tool, and it is difficult to quantitatively evaluate the existing adhesion force evaluation method and it is costly. This study has developed an evaluation method to measure the adhesive force based on the data of the grinding process using a low-cost polishing pad. When the frictional force and the shearing force are applied to the specimen by the sanding belt, friction is continuously generated between the coating layer and the belt, and peeling occurs at the moment when a specific load is applied. Acceleration, load, and torque values that occur during each experiment are collected through acceleration sensors, load cells, and torque sensors. The data obtained through the experiments are subjected to FFT processing and analysis. As a result, the peeling point and the critical load value at this point are identified and referred to as the adhesion force of the coating layer.
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - School of Mechanical System Engineering > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.