Microvia Filling with Copper Electroplated with Quaternary Ammonium-Based Leveler: The Evaluation of Convection-Dependent Adsorption Behavior of the Leveler
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Myung Hyun | - |
dc.contributor.author | Lee, Yoonjae | - |
dc.contributor.author | Oh, Jung Hwan | - |
dc.contributor.author | Kim, Young Gyu | - |
dc.contributor.author | Cho, Sung Ki | - |
dc.contributor.author | Kim, Jae Jeong | - |
dc.date.accessioned | 2024-02-27T13:00:36Z | - |
dc.date.available | 2024-02-27T13:00:36Z | - |
dc.date.issued | 2017 | - |
dc.identifier.issn | 0013-4651 | - |
dc.identifier.issn | 1945-7111 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/26985 | - |
dc.description.abstract | In this study, we synthesized a leveler that contained two quaternary ammonium groups attached to hexaethylene glycol. The leveler enabled void- and seam-less Cu filling of the microvia. The convection-dependent adsorption of the leveler was assessed through electrochemical analyses such as linear sweep voltammetry and chronoamperometry on a rotating disk electrode, and the effect of convection on the adsorption of the leveler is interpreted in terms of adsorption diffusion model. In a Koutecky-Levich plot, the enhanced adsorption and inhibition of the leveler at the higher convection was clearly observed with the synthesized leveler. (c) 2017 The Electrochemical Society. | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | ELECTROCHEMICAL SOC INC | - |
dc.title | Microvia Filling with Copper Electroplated with Quaternary Ammonium-Based Leveler: The Evaluation of Convection-Dependent Adsorption Behavior of the Leveler | - |
dc.type | Article | - |
dc.publisher.location | 미국 | - |
dc.identifier.doi | 10.1149/2.0121802jes | - |
dc.identifier.wosid | 000419187700098 | - |
dc.identifier.bibliographicCitation | JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.164, no.14, pp D1051 - D1055 | - |
dc.citation.title | JOURNAL OF THE ELECTROCHEMICAL SOCIETY | - |
dc.citation.volume | 164 | - |
dc.citation.number | 14 | - |
dc.citation.startPage | D1051 | - |
dc.citation.endPage | D1055 | - |
dc.type.docType | Article | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | sci | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Electrochemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Electrochemistry | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.subject.keywordPlus | 3-DIMENSIONAL CHIP STACKING | - |
dc.subject.keywordPlus | ASPECT-RATIO COPPER | - |
dc.subject.keywordPlus | CU ELECTRODEPOSITION | - |
dc.subject.keywordPlus | POLYETHYLENE-GLYCOL | - |
dc.subject.keywordPlus | PERFORMANCE | - |
dc.subject.keywordPlus | ADDITIVES | - |
dc.subject.keywordPlus | IONS | - |
dc.subject.keywordPlus | BATH | - |
dc.subject.keywordPlus | CL | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
350-27, Gumi-daero, Gumi-si, Gyeongsangbuk-do, Republic of Korea (39253)054-478-7170
COPYRIGHT 2020 Kumoh University All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.