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다이 및 와이어 본딩 공정을 위한 Sn-Sb Backside Metal의 계면 구조 및 전단 강도 분석
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최여진; 백승문; 이유나;
안성진
Article
Issue Date
2024
Citation
한국재료학회지, v.34, no.3, pp 170 - 174
Publisher
한국재료학회
1
Discover
Author
An, sung jin
1
백승문
1
이유나
1
최여진
1
Subject
ALLOYS
1
backside metal
1
INTERFACIAL REACTIONS
1
nanomaterials
1
PB-FREE SOLDER
1
POWER ELECTRONICS
1
shear strength.
1
Sn-Sb
1
TEMPERATURE
1
Date Issued
2024
1
Language
KOR
1
BROWSE
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