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Thermo-Electromechanical Analysis of Composite Plates via Recovery Process of using Stress Resultant Equivalence
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Jun-sik | - |
| dc.date.available | 2020-04-24T22:26:40Z | - |
| dc.date.created | 2020-04-01 | - |
| dc.date.issued | 2016-07-26 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/6557 | - |
| dc.publisher | 한국전산역학회 | - |
| dc.title | Thermo-Electromechanical Analysis of Composite Plates via Recovery Process of using Stress Resultant Equivalence | - |
| dc.title.alternative | Thermo-Electromechanical Analysis of Composite Plates via Recovery Process of using Stress Resultant Equivalence | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | Kim, Jun-sik | - |
| dc.identifier.bibliographicCitation | WCCM XII & APCOM VI, v.1, no.1, pp.1-1 | - |
| dc.relation.isPartOf | WCCM XII & APCOM VI | - |
| dc.relation.isPartOf | Proceedings of WCCM XII & APCOM VI | - |
| dc.citation.title | WCCM XII & APCOM VI | - |
| dc.citation.volume | 1 | - |
| dc.citation.number | 1 | - |
| dc.citation.startPage | 1-1 | - |
| dc.citation.endPage | 1-1 | - |
| dc.citation.conferencePlace | KO | - |
| dc.citation.conferencePlace | 서울 코엑스 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 2 | - |
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Related Researcher
- Kim, Jun sik
- College of Engineering (School of Mechanical System Engineering)