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Results 1-1 of 1 (Search time: 0.01 seconds).
Effect of sodium dodecyl sulphate on Cu electrodeposition: interaction with hydrophobic substrate and Cu ions
Kim, In Ui; Gwon, Ye Ri; Shin, Yeong Min; Cho, Sung Ki
Article
Issue Date
2022
Citation
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, v.100, no.3, pp 152 - 158
Publisher
TAYLOR & FRANCIS LTD
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Author
Shin, Yeong Min
1
Subject
ACID
1
ADSORPTION
1
anionic surfactant
1
COPPER ELECTRODEPOSITION
1
Cu electrodeposition
1
diffusion coefficient (D)
1
EDGE-PLANE SITES
1
ELECTROCHEMISTRY
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glassy carbon
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