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두께방향의 워핑함수를 고려한 일반화된 복합재료 적층평판의 응력해석 기법Thermal Stress Analysis of Laminated Composite Plates using 3D Warping Function
- Alternative Title
- Thermal Stress Analysis of Laminated Composite Plates using 3D Warping Function
- Authors
- Kim, Jun-sik
- Issue Date
- 4-Apr-2014
- Publisher
- 한국전산구조공학회
- Citation
- 2014 한국전산구조공학회 정기학술대회, v.1, no.1, pp.91
- Conference Name
- 2014 한국전산구조공학회 정기학술대회
- Place
- KO
경북대학교 글로벌플라자
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Collections - School of Mechanical System Engineering > 2. Conference Papers
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Related Researcher
- Kim, Jun sik
- College of Engineering (School of Mechanical System Engineering)