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High-resolution Patterning Using Two Modes of Electrohydrodynamic Jet: Drop on Demand and Near-field Electrospinning

Authors
Thanh Huy PhungOh, SoobinKwon, Kye-Si
Issue Date
Jul-2018
Publisher
MYJoVE Corporation
Keywords
Bioengineering; Issue 137; Electrohydrodynamic; EHD; drop-on-demand printing; DOD; near-field electrospinning; NFES; inkjet; fine patterning; printing
Citation
Journal of Visualized Experiments, no.137
Journal Title
Journal of Visualized Experiments
Number
137
URI
https://scholarworks.bwise.kr/sch/handle/2021.sw.sch/5826
DOI
10.3791/57846
ISSN
1940-087X
Abstract
Electrohydrodynamic (EHD) jet printing has drawn attention in various fields because it can be used as a high-resolution and low-cost direct patterning tool. EHD printing uses a fluidic supplier to maintain the extruded meniscus by pushing the ink out of the nozzle tip. The electric field is then used to pull the meniscus down to the substrate to produce high-resolution patterns. Two modes of EHD printing have been used for fine patterning: continuous near-field electrospinning (NFES) and dot-based drop-on-demand (DOD) EHD printing. According to the printing modes, the requirements for the printing equipment and ink viscosity will differ. Even though two different modes can be implemented with a single EHD printer, the realization methods significantly differ in terms of ink, fluidic system, and driving voltage. Consequently, without a proper understanding of the jetting requirements and limitations, it is difficult to obtain the desired results. The purpose of this paper is to present a guideline so that inexperienced researchers can reduce the trial and error efforts to use the EHD jet for their specific research and development purposes. To demonstrate the fine-patterning implementation, we use Ag nanoparticle ink for the conductive patterning in the protocol. In addition, we also present the generalized printing guidelines that can be used for other types of ink for various fine-patterning applications.
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College of Engineering (Department of Mechanical Engineering)
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