EPA ECC: Error-Pattern-Aligned ECC for HBM2E
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kwon, K.[Kwon, Kiheon] | - |
dc.contributor.author | Kim, D.[Kim, Dongwhee] | - |
dc.contributor.author | Park, S.[Park, Soyoung] | - |
dc.contributor.author | Kim, J.[Kim, Jungrae] | - |
dc.date.accessioned | 2023-09-21T06:46:19Z | - |
dc.date.available | 2023-09-21T06:46:19Z | - |
dc.date.created | 2023-09-21 | - |
dc.date.issued | 2023 | - |
dc.identifier.issn | 0000-0000 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/108465 | - |
dc.description.abstract | DRAM vendors introduced On-Die Error Correction Codes (OD-ECC) to correct errors internally. Most OD-ECCs are based on Single Error Correction to correct individual bit errors. However, recent soft error experiments on HBM2 reveal that DRAM frequently experiences multi-bit errors, necessitating a stronger OD-ECC solution. This paper introduces a novel OD-ECC, EPA ECC, specifically designed to correct frequently-observed multi-bit error patterns. The key innovation of EPA ECC is the construction of multi-bit symbols aligned with common error patterns, and the application of Reed-Solomon codes to correct severe errors without increasing the redundancy ratio. Our evaluation demonstrates that EPA ECC provides higher memory reliability than the current SEC-DED OD-ECC without incurring significant system performance degradation. © 2023 IEEE. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.title | EPA ECC: Error-Pattern-Aligned ECC for HBM2E | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kwon, K.[Kwon, Kiheon] | - |
dc.contributor.affiliatedAuthor | Kim, D.[Kim, Dongwhee] | - |
dc.contributor.affiliatedAuthor | Park, S.[Park, Soyoung] | - |
dc.contributor.affiliatedAuthor | Kim, J.[Kim, Jungrae] | - |
dc.identifier.doi | 10.1109/ITC-CSCC58803.2023.10212882 | - |
dc.identifier.scopusid | 2-s2.0-85169803182 | - |
dc.identifier.bibliographicCitation | 2023 International Technical Conference on Circuits/Systems, Computers, and Communications, ITC-CSCC 2023 | - |
dc.relation.isPartOf | 2023 International Technical Conference on Circuits/Systems, Computers, and Communications, ITC-CSCC 2023 | - |
dc.citation.title | 2023 International Technical Conference on Circuits/Systems, Computers, and Communications, ITC-CSCC 2023 | - |
dc.type.rims | ART | - |
dc.type.docType | Conference paper | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordAuthor | ECC | - |
dc.subject.keywordAuthor | HBM2E | - |
dc.subject.keywordAuthor | on-die ECC | - |
dc.subject.keywordAuthor | reliability | - |
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