Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints
DC Field | Value | Language |
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dc.contributor.author | Kim, J.[Kim, J.] | - |
dc.contributor.author | Jung, S.-B.[Jung, S.-B.] | - |
dc.contributor.author | Yoon, J.-W.[Yoon, J.-W.] | - |
dc.date.accessioned | 2021-07-29T03:45:36Z | - |
dc.date.available | 2021-07-29T03:45:36Z | - |
dc.date.created | 2019-11-29 | - |
dc.date.issued | 2019-10-15 | - |
dc.identifier.issn | 0925-8388 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/14884 | - |
dc.description.abstract | We investigated the interfacial reactions and mechanical reliabilities of different Ni layer thicknesses and P-containing Pd layers in thin electroless-Ni electroless-Pd immersion gold (thin-Au/Pd(P)/Ni(P)) surface-finished printed circuit board (PCBs) with Sn-3.0Ag-0.5Cu (SAC 305) solder joints. To analyze the optimal Ni layer thickness in the thin-Au/Pd(P)/Ni(P) for aging, we evaluated 0.3- to 1.0-μm Ni layers in thin-Au/Pd(P)/Ni(P) PCBs with SAC 305 solder joints aged at 75, 100, 125, and 150 °C for 1000 h. A scallop-type (Cu,Ni)6Sn5 intermetallic compound (IMC) dominantly formed at the bottom and top sides of the interfaces of all Ni joints under all aging conditions. Furthermore, a P-rich Ni layer formed at the interface between the (Cu,Ni)6Sn5 IMC and Cu substrate during aging regardless of Ni layer thickness. The (Cu,Ni)6Sn5 IMCs of the joints with 0.3- and 0.5-μm Ni layers aged at 125 and 150 °C for 1000 h were thicker than those of 0.7- and 1.0-μm Ni layers. In high-speed shear tests, the shear strength reduction rates of the joints with 0.3-μm Ni layer aged at 125 and 150 °C were higher than those of the 0.7- and 1.0-μm Ni layers. The brittle fracture rates of the joints with 0.3- and 0.5-μm Ni layers aged at 150 °C for 1000 h were higher than those of the 0.7- and 1.0-μm Ni layers. We determined that these trends arose from the diffusion barrier role of the relatively thick P-rich Ni layers maintained at the interfaces of the joints with 0.7- and 1.0-μm Ni layers for all aging temperatures and times. In low-speed shear tests, the shear strengths of the joints with 0.3-μm Ni layer were slightly lower than those of the 0.5- to 1.0-μm Ni layers. The low- and high-speed shear strengths of the joint with 0.7-μm Ni layer were similar to those of the 1.0-μm Ni layers for each condition. Therefore, Ni joint thicknesses of over 0.7 μm are expected to provide high reliability for aging. © 2019 Elsevier B.V. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Elsevier Ltd | - |
dc.subject | Copper alloys | - |
dc.subject | Diffusion barriers | - |
dc.subject | Lead-free solders | - |
dc.subject | Printed circuit boards | - |
dc.subject | Reliability | - |
dc.subject | Silver alloys | - |
dc.subject | Soldered joints | - |
dc.subject | Soldering | - |
dc.subject | Strength of materials | - |
dc.subject | Surface chemistry | - |
dc.subject | Ternary alloys | - |
dc.subject | Tin alloys | - |
dc.subject | Aging temperatures | - |
dc.subject | Electroless | - |
dc.subject | Mechanical reliability | - |
dc.subject | Printed circuit board (PCBs) | - |
dc.subject | Reliability Evaluation | - |
dc.subject | Shear strength reduction | - |
dc.subject | Sn-3.0Ag-0.5Cu | - |
dc.subject | Sn-3.0ag-0.5cu solders | - |
dc.subject | Nickel compounds | - |
dc.title | Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, J.[Kim, J.] | - |
dc.contributor.affiliatedAuthor | Jung, S.-B.[Jung, S.-B.] | - |
dc.identifier.doi | 10.1016/j.jallcom.2019.07.184 | - |
dc.identifier.scopusid | 2-s2.0-85069592658 | - |
dc.identifier.wosid | 000482184100117 | - |
dc.identifier.bibliographicCitation | Journal of Alloys and Compounds, v.805, pp.1013 - 1024 | - |
dc.relation.isPartOf | Journal of Alloys and Compounds | - |
dc.citation.title | Journal of Alloys and Compounds | - |
dc.citation.volume | 805 | - |
dc.citation.startPage | 1013 | - |
dc.citation.endPage | 1024 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Physical | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | Copper alloys | - |
dc.subject.keywordPlus | Diffusion barriers | - |
dc.subject.keywordPlus | Lead-free solders | - |
dc.subject.keywordPlus | Printed circuit boards | - |
dc.subject.keywordPlus | Reliability | - |
dc.subject.keywordPlus | Silver alloys | - |
dc.subject.keywordPlus | Soldered joints | - |
dc.subject.keywordPlus | Soldering | - |
dc.subject.keywordPlus | Strength of materials | - |
dc.subject.keywordPlus | Surface chemistry | - |
dc.subject.keywordPlus | Ternary alloys | - |
dc.subject.keywordPlus | Tin alloys | - |
dc.subject.keywordPlus | Aging temperatures | - |
dc.subject.keywordPlus | Electroless | - |
dc.subject.keywordPlus | Mechanical reliability | - |
dc.subject.keywordPlus | Printed circuit board (PCBs) | - |
dc.subject.keywordPlus | Reliability Evaluation | - |
dc.subject.keywordPlus | Shear strength reduction | - |
dc.subject.keywordPlus | Sn-3.0Ag-0.5Cu | - |
dc.subject.keywordPlus | Sn-3.0ag-0.5cu solders | - |
dc.subject.keywordPlus | Nickel compounds | - |
dc.subject.keywordAuthor | Electroless-nickel electroless-palladium immersion gold (ENEPIG) | - |
dc.subject.keywordAuthor | Interfacial reaction | - |
dc.subject.keywordAuthor | Mechanical strength | - |
dc.subject.keywordAuthor | Ni thickness | - |
dc.subject.keywordAuthor | Sn-3.0Ag-0.5Cu | - |
dc.subject.keywordAuthor | Solder | - |
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