Park, H.[Park, H.]; Kim, Y.[Kim, Y.]; Song, J.C.[Song, J.C.]; Lee, J.[Lee, J.]; PHAM, D. P.[PHAM, DUY PHONG]; Lee, S.[Lee, S.]; Kim, J.[Kim, J.]; Huh, Y.[Huh, Y.]; Yi, J.[Yi, J.]
ArticleIssue Date2021CitationJournal of Materials Science: Materials in Electronics, v.32, no.3, pp.3912 - 3919PublisherSpringer