Kim, H.[Kim, H.]; Park, J.[Park, J.]; Park, J.[Park, J.]; Woo, H.[Woo, H.]; Lee, J.[Lee, J.]; Park, Y.[Park, Y.]; Khim, T.[Khim, T.]; Kim, J.[Kim, J.]; Lee, J.[Lee, J.]; Song, J.[Song, J.], et al.
ArticleIssue Date2021CitationElectronic Materials Letters, v.17, no.3, pp.215 - 221PublisherKorean Institute of Metals and Materials