Gu, H.[Gu, H.]; Yaman, B.[Yaman, B.]; Moeller, S.[Moeller, S.]; Chun, I.Y.[Chun, I.Y.]; Akcakaya, M.[Akcakaya, M.]
ArticleIssue Date2022Citation2022 IEEE 13th Annual Information Technology, Electronics and Mobile Communication Conference, IEMCON 2022, pp.197 - 201PublisherInstitute of Electrical and Electronics Engineers Inc.