Lee, H.[Lee, H.]; Lim, W.[Lim, W.]; Bae, J.[Bae, J.]; Lee, W.[Lee, W.]; Kang, H.[Kang, H.]; Yang, Y.[Yang, Y.]
ArticleIssue Date2017CitationIEEE MTT-S International Microwave Symposium Digest, pp.774 - 777PublisherInstitute of Electrical and Electronics Engineers Inc.