Kang, H.[Kang, H.]; Lee, W.[Lee, W.]; Oh, S.[Oh, S.]; Oh, H.[Oh, H.]; JIN, C. W.[JIN, CHOI WOO]; Lee, H.[Lee, H.]; Hwang, K.C.[Hwang, K.C.]; Lee, K.[Lee, K.]; Yang, Y.[Yang, Y.]
ArticleIssue Date2021CitationIEEE Microwave and Wireless Components Letters, v.31, no.3, pp.280 - 283PublisherInstitute of Electrical and Electronics Engineers Inc.