Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Tariq, HA[Tariq, Hussain Ahmed] | - |
dc.contributor.author | Shoukat, AA[Shoukat, Ahmad Adnan] | - |
dc.contributor.author | Hassan, M[Hassan, Muhammad] | - |
dc.contributor.author | Anwar, M[Anwar, Muhammad] | - |
dc.date.accessioned | 2021-07-28T18:45:14Z | - |
dc.date.available | 2021-07-28T18:45:14Z | - |
dc.date.created | 2019-11-28 | - |
dc.date.issued | 2019-06 | - |
dc.identifier.issn | 1388-6150 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/9794 | - |
dc.description.abstract | We investigated the thermal performance of micro-hole cellular structure using Al2O3-H2O and CuO-H2O nanofluids with 0.67% and 0.4%, respectively, of volumetric concentration numerically and then validated these numerical results with the experimental results at a heating power of 345W. We found that the thermal conductivities of Al2O3-H2O and CuO-H2O nanofluids were enhanced by 2% and 1.19%, respectively, as compared to the base fluid (water). Using Al2O3-H2O nanofluids, we achieved the minimum base temperature of 24.5 degrees C and 26.6 degrees C numerically and experimentally, respectively, for the micro-hole cellular structure. Using CuO-H2O nanofluids, we achieved the minimum base temperature of 25.5 degrees C and 27.7 degrees C numerically and experimentally, respectively. The estimated errors between obtained numerical and experimental results were 8.8% and 8.5% for Al2O3-H2O and CuO-H2O, respectively. Experimentally, we achieved the lowest base temperature of 26.6 degrees C and 27.7 degrees C using Al2O3-H2O and CuO-H2O nanofluids, respectively, which was about 17.6% and 14.5% lower than the reported temperature value of 32.3 degrees C using water (Tariq et al. in Therm Sci, 2018. http://www.doiserbia.nb.rs/Article.aspx?ID=0354-98361800184T). | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | SPRINGER | - |
dc.subject | POWER-LAW FLUID | - |
dc.subject | HEAT-TRANSFER | - |
dc.subject | FORCED-CONVECTION | - |
dc.subject | PRESSURE-DROP | - |
dc.subject | CHANNEL | - |
dc.subject | PERFORMANCE | - |
dc.subject | DESIGN | - |
dc.subject | SINKS | - |
dc.subject | WATER | - |
dc.subject | FLOW | - |
dc.title | Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Shoukat, AA[Shoukat, Ahmad Adnan] | - |
dc.identifier.doi | 10.1007/s10973-018-7852-0 | - |
dc.identifier.scopusid | 2-s2.0-85055983364 | - |
dc.identifier.wosid | 000466162800028 | - |
dc.identifier.bibliographicCitation | JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, v.136, no.5, pp.2171 - 2182 | - |
dc.relation.isPartOf | JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY | - |
dc.citation.title | JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY | - |
dc.citation.volume | 136 | - |
dc.citation.number | 5 | - |
dc.citation.startPage | 2171 | - |
dc.citation.endPage | 2182 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Thermodynamics | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalWebOfScienceCategory | Thermodynamics | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Analytical | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Physical | - |
dc.subject.keywordPlus | POWER-LAW FLUID | - |
dc.subject.keywordPlus | HEAT-TRANSFER | - |
dc.subject.keywordPlus | FORCED-CONVECTION | - |
dc.subject.keywordPlus | PRESSURE-DROP | - |
dc.subject.keywordPlus | CHANNEL | - |
dc.subject.keywordPlus | PERFORMANCE | - |
dc.subject.keywordPlus | DESIGN | - |
dc.subject.keywordPlus | SINKS | - |
dc.subject.keywordPlus | WATER | - |
dc.subject.keywordPlus | FLOW | - |
dc.subject.keywordAuthor | Micro-hole cellular structure | - |
dc.subject.keywordAuthor | Nanofluids | - |
dc.subject.keywordAuthor | Base temperature | - |
dc.subject.keywordAuthor | Convective heat transfer | - |
dc.subject.keywordAuthor | Enhancement in thermal conductivity | - |
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