ScholarWorks@SUNGKYUNKWAN UNIVERSITY: CHAE, HEE YEOP

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CHAE, HEE YEOP (채희엽)

Engineering (Chemical Engineering)

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plasma etching:7||OLED:6||Atomic layer deposition:5||Organic lightemitting diode:4||Encapsulation:4||Moisture barrier:4||endpoint detection:4||Plasma etching:4||Quantum dots:4||Silver nanowire:3||PECVD:3||organic light emitting diodes:3||Plasma enhanced chemical vapor deposition:3||Cathode interfacial layer:3||Charge balance:3||nbsp:3||impedance analysis:3||quantum dots:3||MEHPPV:3||optical emission spectroscopy:3||screen printing:3||Ligand exchange:3||ion flux:2||ligand exchange:2||selfassembled monolayer:2||Optical emission spectroscopy:2||Gravure printing:2||Thin film encapsulation:2||Organic light emitting diode:2||Ampicillin:2||dual frequency RF bias powers:2||sp2/sp3 hybridization ratio:2||Transparent electrode:2||InPbased QDs:2||HTL:2||sup>:2||Plasma treatment:2||modeling:2||moisture barrier films:2||Water vapor transmission rate:2||DC selfbias:2||/sup>:2||Polymer lightemitting diodes:2||Room temperature SiNx:2||etch selectivity:2||Electroluminescence:2||flexible barrier:2||Interface:2||Multilayer barrier films:2||SiO2 sputter etching:2||Atomic layer etching (ALE):2||Silicon nitride:2||perfluorocarbon:2||Ion density:2||EQE:2||bending:2||Forster energy transfer:2||plasma measurements:2||biosensor:2||Photoluminescence:2||Band alignment:2||QD:2||QDLED:2||QDLEDs:2||QLED:2||quantum dot:2||Graphene:2||Quantum dot:2||Graphene oxide:2||ion bombardment energy:2||F radical density:1||FTIR:1||FTIR:1||Fatty acid:1||Flexible Multilayer Films:1||Flexible circuit:1||Flexible device:1||Flexible moisture barrier:1||Flexible substrate:1||Flowable Chemical Vapor Deposition:1||Fluorescence imaging probe:1||Fluorination model:1||Fluorocarbon film:1||Fluorocarbon plasma:1||Forster radius:1||GOXtagged antibody:1||Gaussian mixture model:1||Gravure Printing:1||Green quantum dot light emitting diodes:1||Heatingup synthesis:1||Hexagonal boron nitride:1||Hole extraction layer:1||Hole transport layer:1||Hole transporting material:1||Holetransporting material:1||Hybrid nanolaminate:1||Hybrid nanostructure:1||Hydrogenated Amorphous Carbon:1||Hydrogenated amorphous carbon:1||Hydrosilylation:1||Hygroscopic Al2O3 interlayer:1||ICPCVD etcher:1||ITO:1||InP:1||InP/Ga/ZnS quantum dots:1||Indium phosphide quantum dots:1||Inductively coupled plasma:1||Inp quantum dots:1||Interlayer:1||Invert Structure:1||Ion effect:1||IonEnhanced Etching Model:1||Ionenhanced etching:1||Ir(ppy)(3):1||Isotropic etching:1||Kmeans cluster analysis:1||Leachate&:1||LiF:1||Light scattering:1||Lightemitting electrochemical cells:1||LineEdge Roughness:1||Low dielectric constant:1||Low temperature Al2O3:1||Lowk:1||Lowk D:1||Luminous efficiency:1||MMTCE:1||Mass spectrometry:1||Mechanical interlocking:1||Metal nanowire:1||Metal oxide nanoparticles:1||Metallocne compunds:1||Microscale rod:1||Microwave reduction:1||Mn doping:1||Moisture Barrier:1||Moisture Multilayer Barrier Films:1||Moisture barrier films:1||Molybdenum (Mo):1||Molybdenum Oxide:1||MultiLevel Hard Mask Structures:1||Multilayer barrier films:1||Multilevel hard mask:1||Multistep plasma etching:1||Multilayer:1||Multivariate analysis:1||NEXAFS spectroscopy:1||NH3:1||Nanodots:1||Nanofibrillar:1||Nanolaminate:1||Nanoparticle:1||NiMoP Films:1||NonCd blue emitters:1||O2 plasma treatment:1||OLED encapsu:1||On chip packaging:1||Optical Emission Spectroscopy:1||Optical actinometry:1||Organic Solar Cells:1||Organic ligand:1||Organic light emitting diodes:1||Organic salt:1||Organic solar cells:1||PDMS:1||PFC:1||PLEDs:1||PMDA:1||PVK:1||Patterning:1||Perovskite solar cell:1||Pho:1||Phosphor:1||Phosphorescence:1||Photostability:1||Planarization Effect:1||Plasma Atomic Layer Deposition:1||Plasma Characteristics:1||Plasma Deposition:1||Plasma Enhanced Chemical Vapor Deposition:1||Plasma Etching:1||Plasma Polymerization:1||Plasma Surface Treatment:1||Plasma diagnosis:1||Plasma enhanced CVD:1||Plasma enhanced atomic layer deposition:1||Plasma polymer:1||Plasma polymer films:1||Plasma process:1||Plasma surface fluorination:1||Plasma surface treatment:1||Point defect:1||Polyimide:1||Polymer Solar Cells:1||Polymer solar cell:1||Polymer solar cells:1||Polymeric micelle:1||Polysilicic Acid:1||Principal component analysis:1||Principal component regression:1||Protein design:1||Protein folding:1||Proteinprotein interaction:1||PulseBiased Etching:1||Pulsebiased plasma:1||QDPolymer bead:1||QDsbased FRET:1||Qled:1||Quadrupole Mass Spectrometer:1||Quantum dot lightemitting diodes (QLEDs):1||Quantum dots (QDS):1||Quantum dots (QDs):1||Quantun dot:1||RC membrane:1||Radical etching:1||Raman:1||Ratio:1||Reactant Residence Time:1||Reaction Mechanism:1||Reaction byproduct:1||Reaction kinetics:1||Reactive ion etching (RIE):1||Redistribution layer:1||Reduced graphene oxide:1||Relative Ratio of Fluorine and Carbon:1||Remote plasma atomic layer deposition:1||Rolltoroll:1||Rubrene:1||Screen printing:1||Sibased solar cell:1||SiCOH:1||Silicon Nitride:1||Silicon oxide:1||Siloxane:1||Silver Nanowire:1||Solvent effect:1||Sp2rich hydrogenated amorphous carbon:1||Spatial ALD:1||Spatially ALD:1||Spatially resolved atomic layer deposition:1||Stability:1||Strain gauge sensor:1||Supercapacitor:1||Superhydrophobic:1||Supramolecular assembly:1||Surface roughness:1||Surface treatment:1||Suspension polymerization:1||TCTA:1||TEMAH:1||TMA:1||Thermal Treatment:1||Thermaland photostability:1||Thin:1||Thin Film Encapsulation:1||TiCl4:1||Titaniu:1||Titanium oxide:1||Transpar:1||VI probe:1||WLEDs:1||WVTR:1||Wettability:1||White OLEDs:1||White light emitting diode:1||XPS:1||Zinc Oxide:1||actinometry:1||adhesive gel buffer layer:1||admittance analysis:1||admittance spectroscopy:1||aligned nanofibers:1||all solution processing:1||allsolutionprocessed:1||annealing temperature:1||atomic layer etching:1||barrier height:1||benzenethiol:1||biosensing applications:1||biotinylation:1||bipolar junction transistors:1||capillary force:1||capillary micromolding:1||capping layers:1||carbon nanotube:1||charge balance:1||charge transfer:1||chemical synthesis:1||clofazimine:1||color conversion films:1||conductivity:1||contact holes:1||contacthole etching:1||copper gallium:1||current gain:1||dark spot:1||deepblue emission:1||defectfree transfer:1||degradation:1||dipole moments:1||doping:1||down converters:1||electrical/electronic materials:1||electrochemistry:1||electroless deposition:1||electroless plating:1||electron blocking layer:1||electron doping:1||electron transport layer:1||electrospinning:1||enhancement:1||etch profile:1||etch residue:1||external quantum efficiency:1||flexible device:1||fluorescence:1||gatetunable:1||global warming potential:1||gold:1||graphene:1||graphene forest:1||graphene wall:1||hafnium oxide:1||handoperating:1||heptafluoropropyl methyl ether:1||hexafluoroisopropanol:1||hierarchical nanoturf structures:1||hole extraction layer:1||hole transport:1||hole transport layer:1||hole transport materials:1||hydrogenated amorphous carbon:1||immunosensing:1||immunosensor:1||in vivo imaging:1||insulating blocks:1||interface:1||interfacial layer:1||inverted architecture:1||inverted device:1||labonachip:1||light emitting diodes:1||light outcoupling:1||low GWP:1||low dielectric constant:1||lowGWP:1||metal nucleation inducer:1||metal patterning:1||microcavity:1||microthrough hole membranes:1||microcontact printing:1||microelectronic devices:1||microfluidic dialysis device:1||microfluidics:1||microstructure:1||mixed monolayer:1||molybdenum:1||morphology formation mechanism:1||multiway principal component analysis:1||nanofiber membrane:1||nanostructured materials:1||nanoturf structures:1||nanowelding:1||oligo(ethylene glycol):1||optical emission spectrometer:1||organiclightemittingdiode:1||orientation control:1||oxygen plasma:1||pHresponsive:1||pHtriggerable targeting:1||partial ligand exchange:1||patchable:1||phosphorescence:1||photochem:1||photolithography:1||photoluminescence:1||plasma atomic layer etching:1||plasma atomic layer etching (ALE):1||plasma monitoring:1||plasma treatment:1||polyimide film:1||polymer light emitting diodes:1||polymer solar cell:1||polystyrene:1||porous graphene film:1||prostate specific antigen:1||protein detection:1||protein patterning:1||quantum dot light emitting diodes:1||quantum dot lightemitting diode:1||quantum dot lightemitting diodes:1||quantum dotlightemitting diode:1||quantumdot lightemitting diode:1||reactive ion etching (RIE):1||ruthenium (Ru):1||sandwich QD structure:1||selective metal transfer:1||sensor:1||silicon nitride:1||silicon oxide:1||silicondioxide cleaning:1||silicondioxide etching:1||silver nanowire:1||silver nanowires:1||singlephased quantum dots:1||solarvapor generation:1||sp<:1||spectral clustering algorithm:1||spin coating:1||stability:1||sulfide:1||surface passivation:1||surface plasmon resonance:1||surface roughness:1||surface tension:1||surface treatment:1||thermal release tape:1||thin film:1||topemitting organic lightemitting diode:1||transparent:1||transparent conductive film:1||transparent electrode:1||tungsten diselenide:1||ultrathin metal film:1||van der Waals heterostructures:1||vertically oriented graphene:1||white lighting devices:1||&:1||white photoluminescence:1||/sp<:1||2<:1||3<:1||4aminopyridine:1||A. Oxides:1||AES:1||ALCVD:1||ALE window:1||Adhesion:1||Adhesive transfer:1||Admittance analysis:1||Alkalifree C:1||Aluminium oxide:1||Amorphous carbon:1||Anhydride material:1||Anisotropic etching:1||Atomic Layer Deposition:1||Atomic layer deposition (ALD):1||Atomic layer etching:1||Bandgap:1||Bending Radius:1||Bending property:1||Bilayer printing:1||C. Electrochemical measurements:1||C. Impedance spectroscopy:1||C2H2 plasma:1||CF4 and O2 plasma etching:1||CF4/O2 plasma:1||CFX treatment:1||Carbon nanotubes:1||Carbonrich Al2O3 Interlayer:1||Carrier Balance:1||Carrier balance:1||CdZnSeS/ZnS QDs:1||Cerebral ischemic areas:1||Chargetransfer complex:1||Chemical vapor deposition (CVD):1||CoWP thin films:1||Cobalt etching:1||Color conversion:1||Color conversion efficiency (CCE):1||Color conversion film:1||Color conversion layer:1||Color gamut:1||Color rendering index:1||Colorconversion layer:1||Core/multishell quantum dots:1||Critical Dimensions:1||D. Electrochemical properties:1||D. Energy storage:1||Density functional theory (DFT):1||Downconversion:1||DualFrequency Superimposed CapacitivelyCoupled Plasma (DFSCCP):1||ESD:1||Ecotoxicity&:1||Efficiency:1||Electrical properties:1||Electroless Deposition:1||Electroless copper plating:1||Electron mobility:1||Electrontransporting material:1||Electronic materials:1||Electrophosphorescence:1||Electrospray:1||Electrospray Deposition:1||Endpoint detection:1||Etch residue:1||Etch selectivity:1||Exfoliation:1||

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(03063) 25-2, SUNGKYUNKWAN-RO, JONGNO-GU, SEOUL, KOREAsamsunglib@skku.edu

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