Park, Y.[Park, Y.]; Bui, H.T.[Bui, H.T.]; Sohn, Y.[Sohn, Y.]; Park, C.[Park, C.]; Kim, B.[Kim, B.]; Lee, T.[Lee, T.]; Kim, D.[Kim, D.]; Lee, D.[Lee, D.]; Cho, K.[Cho, K.]; Kim, H.W.[Kim, H.W.], et al.
ArticleIssue Date2023CitationApplied Surface Science, v.611PublisherElsevier B.V.