Lee, K.[Lee, K.]; Kim, M.[Kim, M.]; Park, T.[Park, T.]; Chwa, H.S.[Chwa, H.S.]; Lee, J.[Lee, J.]; Shin, S.[Shin, S.]; Shin, I.[Shin, I.]
ArticleIssue Date2019CitationIEEE Internet of Things Journal, v.6, no.4, pp.6325 - 6344PublisherInstitute of Electrical and Electronics Engineers Inc.