Park, J.[Park, J.]; Kim, H.[Kim, H.]; Choi, P.[Choi, P.]; Jeon, B.[Jeon, B.]; Lee, J.[Lee, J.]; Oh, C.[Oh, C.]; Kim, B.[Kim, B.]; Choi, B.[Choi, B.]
ArticleIssue Date2021CitationElectronic Materials Letters, v.17, no.4, pp.299 - 306PublisherKorean Institute of Metals and Materials