Transceiver with inductive coupling for wireless chip-to-chip communication using a 50-nm digital CMOS process
- Authors
- Lee, Changhyun; Park, Jonghoon; Yoo, Jinho; Cho, Hyungjun; Choi, Jungi; Cho, Jeongho; Park, Changkun
- Issue Date
- Sep-2013
- Publisher
- ELSEVIER SCI LTD
- Keywords
- 3D semiconductor; Coil; LATCH; Wireless communication
- Citation
- MICROELECTRONICS JOURNAL, v.44, no.9, pp.852 - 859
- Journal Title
- MICROELECTRONICS JOURNAL
- Volume
- 44
- Number
- 9
- Start Page
- 852
- End Page
- 859
- URI
- http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/11194
- DOI
- 10.1016/j.mejo.2013.07.006
- ISSN
- 0026-2692
- Abstract
- A wireless type of chip-to-chip communication (WCC) technology is proposed as the next generation of 3D semiconductor technology. To demonstrate the feasibility of this technology, we designed a coil, transmitter and receiver for wireless chip-to-chip communication using a 50-nm digital CMOS process. The coil is designed using inductive coupling with design parameters that include the number of turns, the metal width, and the space between adjacent metal lines. A differential transceiver structure is proposed for the WCC technology. The transmitter of the transceiver acts as a termination and bias circuit for the receiver while the transceiver is operating as a receiver. The receiver is designed with a typical differential amplifier and a latch to recover the transmitted original digital signal. The proposed transceiver and coil for the proposed WCC technology is implemented using commercial 50-nm digital CMOS technology. Experimental results successfully demonstrate the feasibility of the WCC technology. (C) 2013 The Authors. Published by Elsevier Ltd. All rights reserved.
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