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Lead-Free All-Inorganic Cesium Tin Iodide Perovskite for Filamentary and Interface-Type Resistive Switching toward Environment-Friendly and Temperature-Tolerant Nonvolatile Memories

Authors
Han, Ji SuQuyet Van LeChoi, JaehoKim, HyojungKim, Sun GilHong, KootakMoon, Cheon WooKim, Taemin LudvicKim, Soo YoungJang, Ho Won
Issue Date
Feb-2019
Publisher
AMER CHEMICAL SOC
Keywords
lead-free halide perovskite; all-inorganic halide perovskite; resistive switching memory; electrochemical metallization; valence change mechanism
Citation
ACS APPLIED MATERIALS & INTERFACES, v.11, no.8, pp 8155 - 8163
Pages
9
Journal Title
ACS APPLIED MATERIALS & INTERFACES
Volume
11
Number
8
Start Page
8155
End Page
8163
URI
https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/18214
DOI
10.1021/acsami.8b15769
ISSN
1944-8244
1944-8252
Abstract
Recently, organometallic and all-inorganic halide perovskites (HPs) have become promising materials for resistive switching (RS) nonvolatile memory devices with low power consumption because they show current-voltage hysteresis caused by fast ion migration. However, the toxicity and environmental pollution potential of lead, a common constituent of HPs, has limited the commercial applications of HP-based devices. Here, RS memory devices based on lead-free all-inorganic cesium tin iodide (CsSnI3) perovskites with temperature tolerance are successfully fabricated. The devices exhibit reproducible and reliable bipolar RS characteristics in both Ag and Au top electrodes (TEs) with different switching mechanisms. The Ag TE devices show filamentary RS behavior with ultralow operating voltages (<0.15 V). In contrast, the Au TE devices have interface-type RS behavior with gradual resistance changes. This suggests that the RS characteristics are attributed to either the formation of metal filaments or the ion migration of defects in HPs under applied electric fields. These distinct mechanisms may permit the opportunity to design devices for specific purposes. This work will pave the way for lead-free all-inorganic HP-based nonvolatile memory for commercial application in HP-based devices.
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