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Synergistic effects of various ceramic fillers on thermally conductive polyimide composite films and their model predictions

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dc.contributor.authorSong, Heeseok-
dc.contributor.authorKim, Byoung Gak-
dc.contributor.authorKim, Yong Seok-
dc.contributor.authorBae, Youn-Sang-
dc.contributor.authorKim, Jooheon-
dc.contributor.authorYoo, Youngjae-
dc.date.available2019-05-28T03:35:32Z-
dc.date.issued2019-03-
dc.identifier.issn2073-4360-
dc.identifier.issn2073-4360-
dc.identifier.urihttps://scholarworks.bwise.kr/cau/handle/2019.sw.cau/18573-
dc.description.abstractIn this study, thermally conductive composite films were fabricated using an anisotropic boron nitride (BN) and hybrid filler system mixed with spherical aluminum nitride (AlN) or aluminum oxide (Al 2 O 3 ) particles in a polyimide matrix. The hybrid system yielded a decrease in the through-plane thermal conductivity, however an increase in the in-plane thermal conductivity of the BN composite, resulting from the horizontal alignment and anisotropy of BN. The behavior of the in-plane thermal conductivity was theoretically treated using the Lewis-Nielsen and modified Lewis-Nielsen theoretical prediction models. A single-filler system using BN exhibited a relatively good fit with the theoretical model. Moreover, a hybrid system was developed based on two-population approaches, the additive and multiplicative. This development represented the first ever implementation of two different ceramic conducting fillers. The multiplicative-approach model yielded overestimated thermal conductivity values, whereas the additive approach exhibited better agreement for the prediction of the thermal conductivity of a binary-filler system. © 2019 by the authors.-
dc.language영어-
dc.language.isoENG-
dc.publisherMDPI AG-
dc.titleSynergistic effects of various ceramic fillers on thermally conductive polyimide composite films and their model predictions-
dc.typeArticle-
dc.identifier.doi10.3390/polym11030484-
dc.identifier.bibliographicCitationPolymers, v.11, no.3-
dc.description.isOpenAccessY-
dc.identifier.wosid000464506100011-
dc.identifier.scopusid2-s2.0-85063367183-
dc.citation.number3-
dc.citation.titlePolymers-
dc.citation.volume11-
dc.type.docTypeArticle-
dc.publisher.location스위스-
dc.subject.keywordAuthorBinary filler-
dc.subject.keywordAuthorModeling-
dc.subject.keywordAuthorPolymer composite-
dc.subject.keywordAuthorThermal conductivity-
dc.subject.keywordPlusAdditives-
dc.subject.keywordPlusAlumina-
dc.subject.keywordPlusAluminum nitride-
dc.subject.keywordPlusAluminum oxide-
dc.subject.keywordPlusAnisotropy-
dc.subject.keywordPlusCeramic materials-
dc.subject.keywordPlusComposite films-
dc.subject.keywordPlusConductive films-
dc.subject.keywordPlusFilled polymers-
dc.subject.keywordPlusFillers-
dc.subject.keywordPlusForecasting-
dc.subject.keywordPlusHybrid systems-
dc.subject.keywordPlusIII-V semiconductors-
dc.subject.keywordPlusModels-
dc.subject.keywordPlusNitrides-
dc.subject.keywordPlusOxide films-
dc.subject.keywordPlusPolyimides-
dc.subject.keywordPlusAluminum nitride (AlN)-
dc.subject.keywordPlusConductive composites-
dc.subject.keywordPlusConductive polyimides-
dc.subject.keywordPlusHorizontal alignment-
dc.subject.keywordPlusMultiplicative approach-
dc.subject.keywordPlusPolymer composite-
dc.subject.keywordPlusTheoretical modeling-
dc.subject.keywordPlusThrough-plane thermal conductivities-
dc.subject.keywordPlusThermal conductivity-
dc.relation.journalResearchAreaPolymer Science-
dc.relation.journalWebOfScienceCategoryPolymer Science-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
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