The effect of epoxy polymer addition in Sn-Ag-Cu and Sn-Bi solder joints
DC Field | Value | Language |
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dc.contributor.author | Kang, M.-S. | - |
dc.contributor.author | Kim, D.-S. | - |
dc.contributor.author | Shin, Y.-E. | - |
dc.date.available | 2019-05-28T03:35:37Z | - |
dc.date.issued | 2019-03 | - |
dc.identifier.issn | 1996-1944 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/18576 | - |
dc.description.abstract | To analyze the reinforcement effect of adding polymer to solder paste, epoxies were mixed with two currently available Sn-3.0Ag-0.5Cu (wt.% SAC305) and Sn-59Bi (wt.%) solder pastes and specimens prepared by bonding chip resistors to a printed circuit board. The effect of repetitive thermal stress on the solder joints was then analyzed experimentally using thermal shock testing (-40 °C to 125 °C) over 2000 cycles. The viscoplastic stress-strain curves generated in the solder were simulated using finite element analysis, and the hysteresis loop was calculated. The growth and propagation of cracks in the solder were also predicted using strain energy formulas. It was confirmed that the epoxy paste dispersed the stress inside the solder joint by externally supporting the solder fillet, and crack formation was suppressed, improving the lifetime of the solder joint. © 2019 by the authors. Licensee MDPI, Basel, Switzerland. | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | MDPI AG | - |
dc.title | The effect of epoxy polymer addition in Sn-Ag-Cu and Sn-Bi solder joints | - |
dc.type | Article | - |
dc.identifier.doi | 10.3390/ma12060960 | - |
dc.identifier.bibliographicCitation | Materials, v.16, no.6 | - |
dc.description.isOpenAccess | N | - |
dc.identifier.wosid | 000465025400042 | - |
dc.identifier.scopusid | 2-s2.0-85063532827 | - |
dc.citation.number | 6 | - |
dc.citation.title | Materials | - |
dc.citation.volume | 16 | - |
dc.type.docType | Article | - |
dc.publisher.location | 스위스 | - |
dc.subject.keywordAuthor | Finite element methods | - |
dc.subject.keywordAuthor | Polymer solder | - |
dc.subject.keywordAuthor | Prediction of life | - |
dc.subject.keywordPlus | Binary alloys | - |
dc.subject.keywordPlus | Bismuth alloys | - |
dc.subject.keywordPlus | Copper alloys | - |
dc.subject.keywordPlus | Cracks | - |
dc.subject.keywordPlus | Finite element method | - |
dc.subject.keywordPlus | Polymers | - |
dc.subject.keywordPlus | Printed circuit boards | - |
dc.subject.keywordPlus | Shock testing | - |
dc.subject.keywordPlus | Silver alloys | - |
dc.subject.keywordPlus | Soldered joints | - |
dc.subject.keywordPlus | Soldering | - |
dc.subject.keywordPlus | Strain energy | - |
dc.subject.keywordPlus | Stress-strain curves | - |
dc.subject.keywordPlus | Ternary alloys | - |
dc.subject.keywordPlus | Tin alloys | - |
dc.subject.keywordPlus | Chip resistor | - |
dc.subject.keywordPlus | Epoxy pastes | - |
dc.subject.keywordPlus | Epoxy polymers | - |
dc.subject.keywordPlus | Propagation of cracks | - |
dc.subject.keywordPlus | Reinforcement effects | - |
dc.subject.keywordPlus | Sn-3.0Ag-0.5Cu | - |
dc.subject.keywordPlus | Solder joints | - |
dc.subject.keywordPlus | Viscoplastic | - |
dc.subject.keywordPlus | Lead-free solders | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Physical | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
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