Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant
DC Field | Value | Language |
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dc.contributor.author | Kwon, Yumi | - |
dc.contributor.author | Yim, Byung-seung | - |
dc.contributor.author | Kim, Jong-min | - |
dc.contributor.author | Kim, Jooheon | - |
dc.date.available | 2019-05-29T13:37:08Z | - |
dc.date.issued | 2011-04 | - |
dc.identifier.issn | 0026-2714 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/21628 | - |
dc.description.abstract | The mechanical and wetting properties of the diglycidyl ethers of bisphenol A (DGEBA) and bisphenol F (DGEBF) with epoxy-terminated siloxane oligomers (ETSO) were investigated to examine their durabilities as anisotropic conductive adhesive (ACA) resins. The mechanical properties were improved by decreasing the MO content due to the high cross-linking density resulting from the short-chain length of ETSO-diaminodiphenylmethane (DDM). To obtain good wettability in both systems, a short-chain reductant (butanoic acid, BA) was added. DGEBF produced enhancement in the wetting angle compared to that of DGEBA due to its low viscosity. DGEBF can be considered an eco-friendly material in this process since it does not require the use of other chemicals, such as a diluent. Therefore, DGEBF/ETSO-DDM with reductant constitutes a suitable system for favorable environmental processing. (C) 2010 Elsevier Ltd. All rights reserved. | - |
dc.format.extent | 7 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.title | Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant | - |
dc.type | Article | - |
dc.identifier.doi | 10.1016/j.microrel.2010.11.001 | - |
dc.identifier.bibliographicCitation | MICROELECTRONICS RELIABILITY, v.51, no.4, pp 819 - 825 | - |
dc.description.isOpenAccess | N | - |
dc.identifier.wosid | 000288977500013 | - |
dc.identifier.scopusid | 2-s2.0-79952188942 | - |
dc.citation.endPage | 825 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 819 | - |
dc.citation.title | MICROELECTRONICS RELIABILITY | - |
dc.citation.volume | 51 | - |
dc.type.docType | Article | - |
dc.publisher.location | 영국 | - |
dc.subject.keywordPlus | ISOTROPIC CONDUCTIVE ADHESIVES | - |
dc.subject.keywordPlus | MELTING POINT SOLDER | - |
dc.subject.keywordPlus | DIAMINE | - |
dc.subject.keywordPlus | ETHER | - |
dc.subject.keywordPlus | DGEBA | - |
dc.subject.keywordPlus | FILM | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.description.journalRegisteredClass | sci | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
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